Circuitry for allowing multiple sensors on a semiconductor die to share a common sensor pad
AssigneeWolfspeed, Inc.
InventorThomas Harrington
Life of this patent
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Abstract
A semiconductor die includes a sensor pad, first sensor circuitry electrically connected to the sensor pad, and isolation circuitry coupled between the first sensor circuitry and the sensor pad. The isolation circuitry may be configured to selectively block an electrical current from flowing from the sensor pad to the first sensor circuitry. The semiconductor die may further include second sensor circuitry electrically connected to the sensor pad. The first sensor circuitry may include a current sensor, and the second sensor circuitry may include a temperature sensor.
Claims26
A semiconductor die, comprising:
- a sensor pad;
- first sensor circuitry electrically connected to the sensor pad;
- and
- isolation circuitry coupled between the first sensor circuitry and the sensor pad.
(canceled)
A semiconductor die, comprising:
- a power transistor device;
- first sensor circuitry;
- second sensor circuitry;
- and
- isolation circuitry coupled between the first sensor circuitry and the second sensor circuitry, the isolation circuitry being configured to block an electrical current from flowing to the first sensor circuitry.
-28. (canceled)
A semiconductor die, comprising:
- a first MOSFET having a first source pad;
- a second MOSFET having a second source pad;
- and
- a temperature sensor electrically coupled to the second source pad.
-41. (canceled)
Dependencies are inferred from the claim text.