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US 2026/0103791 A1Published application
System and method for processing substrate
AssigneeTokyo Electron Limited
InventorsRonald Nasman, Peter D'Elia
Life of this patent
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Abstract
A method for processing a substrate includes dispensing a processing fluid onto the substrate in a processing chamber from an opening through an upper surface of the processing chamber and displacing the processing fluid in the processing chamber with a dry fluid injected through the opening as a wavefront pulse. The opening is near an edge of the substrate. The dry fluid displaces the processing fluid through a conduit opposite the opening.
Claims20
A method for processing a substrate, the method comprising:
- dispensing a processing fluid onto the substrate in a processing chamber from an opening through an upper surface of the processing chamber, the opening near an edge of the substrate;
- and
- displacing the processing fluid in the processing chamber with a dry fluid injected through the opening as a wavefront pulse, the dry fluid displacing the processing fluid through a conduit opposite the opening.
A method for processing a substrate, the method comprising:
- dispensing an etch chemistry into a processing space, the processing space holding the substrate;
- displacing the etch chemistry through the processing space with a wavefront pulse of deionized water;
- displacing the deionized water through the processing space with a wavefront pulse of isopropyl alcohol (IPA);
- and
- displacing the IPA through the processing space with a wavefront pulse of liquid carbon dioxide (CO2).
2 more elements
A processing system comprising:
- a processing chamber comprising an opening in an upper surface of the processing chamber, the opening being coupled to respective supplies of a processing fluid and a dry fluid, the processing chamber being configured to:
- receive a substrate in a processing space within the processing chamber;
- dispense a processing fluid over the substrate from the opening;
- and
- displace the processing fluid with a wavefront pulse of a dry fluid from the opening.
2 more elements
Dependencies are inferred from the claim text.