Adhesive compound, adhesive tape, bonded composite, and method for electrically debonding the bonded composite

Abstract

The disclosure relates to an adhesive compound, to an adhesive tape, to a bonded composite, to a method for electrically debonding the bonded composite, and to the use of the adhesive compound for the bonding of components in electronic devices, automobiles, medical devices, and dental devices. The adhesive compound includes at least one electrolyte and a base compound, wherein the base compound comprises at least one first phase (i) including at least one poly(meth)acrylate and at least one second phase (ii) including at least one vinylaromatic block copolymer, such as in particular styrene block copolymer, wherein the adhesive compound contains at least 2.5 parts by weight of electrolytes based on 100 parts by weight of the base compound.

Dependencies are inferred from the claim text.