Composite and Electronic Devices Including Liquid Metal Microparticles, and Method of Preparing Composite

Abstract

Liquid metal microparticles, a method of preparing the liquid metal microparticles, a method of preparing a composite, a composite including liquid metal microparticles, and an electronic device including the liquid metal microparticles. The method of preparing liquid metal microparticles includes injecting liquid metal into a solvent using a syringe, where the syringe includes a piston and a nozzle, a diameter of the nozzle is less than or equal to about 30 micrometers, and an injection rate of the liquid metal with the syringe is greater than or equal to about 0.5 milliliters per minute, and the solvent includes a surfactant in an amount of greater than or equal to about 3 weight percent based on a total weight of the surfactant and the solvent, and the liquid metal and the solvent are each maintained at a temperature greater than or equal to a melting point of the liquid metal.

Dependencies are inferred from the claim text.