Transfer module and semiconductor manufacturing equipment including the same

A transfer module configured to transfer a substrate in semiconductor manufacturing equipment, the transfer module comprising:

• a frame body;
• a track disposed on the frame body;
• a transfer robot configured to travel along the track;
• and
• a particle collection device provided in the frame body,
• wherein the particle collection device comprises:
• a stacked substrate having three-phase electrodes disposed therein, the three-phase electrodes being spaced apart from each other in a horizontal direction;
• and
• a three-phase power supply configured to supply three-phase power to the three-phase electrodes.

Semiconductor manufacturing equipment comprising:

• a load port module comprising a placing table configured to allow a cassette accommodating a substrate to be placed thereon;
• an index module comprising an index robot configured to transfer the substrate with respect to the cassette;
• a transfer module configured to receive the substrate from the index module and to transfer the substrate to one or more process chambers configured to perform processing on the substrate;
• and
• a processing module having the one or more process chambers arranged therein,
• wherein the transfer module comprises:
• a frame body;
• a track disposed on the frame body;
• a transfer robot configured to travel along the track;
• and
• a particle collection device provided in the frame body,
• wherein the particle collection device comprises:
• a stacked substrate having three-phase electrodes disposed therein, the three-phase electrodes being spaced apart from each other in a vertical direction and a horizontal direction;
• and
• a three-phase power supply configured to supply three-phase power to the three-phase electrodes,
• wherein the frame body comprises:
• a column supporting a lower portion of the track;
• a base frame supporting a lower portion of the column;
• and
• a base plate mounted at a central portion of the base frame, the base plate comprising a plurality of first through-holes connected to an exhaust fan configured to generate a negative pressure,
• wherein the stacked substrate is disposed on the base plate and comprises a plurality of second through-holes formed in alignment with the plurality of first through-holes,
• wherein the stacked substrate comprises:
• a first coating layer;
• a first electrode layer disposed under the first coating layer and electrically connected to the three-phase power supply;
• a first adhesive layer disposed under the first electrode layer;
• a second electrode layer disposed under the first adhesive layer and electrically connected to the three-phase power supply;
• an inner layer material disposed under the second electrode layer;
• a third electrode layer disposed under the inner layer material and electrically connected to the three-phase power supply;
• a second adhesive layer disposed under the third electrode layer;
• a ground electrode layer disposed under the second adhesive layer;
• and
• a second coating layer disposed under the ground electrode layer,
• wherein the first electrode layer has three-phase electrodes and ground electrodes alternately arranged therein in a horizontal direction, the three-phase electrodes being connected to the three-phase power supply, the ground electrodes being connected to a ground,
• wherein, in the first electrode layer, the three-phase electrodes comprise a first three-phase electrode, a second three-phase electrode, and a third three-phase electrode arranged at regular intervals, with the ground electrodes interposed therebetween, and
• wherein the three-phase electrodes are arranged in a first horizontal direction or in a second horizontal direction perpendicular to the first horizontal direction, the first horizontal direction being a traveling direction of the transfer robot.