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US 2026/0101802 A1Published application
Multi-dies structure, multi-dies package structure and package structure
AssigneeChangxin Memory Technologies, Inc.
InventorLING-YI CHUANG
Life of this patent
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Abstract
Provided is a multi-dies stacking structure, which includes: a plurality of core dies stacked, wherein each core die comprises a first sub-core die and a second sub-core die vertically stacked; adjacent core dies are interconnected through micro-metal bumps, and the first sub-core die is interconnected with the second sub-core die through hybrid bonding members.
Claims14
A multi-dies stacking structure, comprising:
- a plurality of core dies stacked, wherein each core die comprises a first sub-core die and a second sub-core die vertically stacked;
- adjacent core dies are interconnected through micro-metal bumps, and the first sub-core die is interconnected with the second sub-core die through hybrid bonding members.
A multi-dies package structure, comprising:
- a logic die;
- a core die located on the logic die, the logic die being electrically connected to the core die;
- wherein the core die comprises a first sub-core die and a second sub-core die located on the first sub-core die, the first sub-core die and the second sub-core die being interconnected by hybrid bonding.
A package structure, comprising:
- a plurality of core dies, wherein the plurality of core dies are interconnected through micro-metal bumps, each core die comprises a first sub-core die and a second sub-core die, the first sub-core die and the second sub-core die are interconnected by hybrid bonding;
- a logic die, wherein the logic die is interconnected with at least one of the plurality of core dies through micro-metal bumps.
Dependencies are inferred from the claim text.