# US 2026/0101801 A1 · Thermal distribution layers in stacked semiconductor architectures

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- Number: US 2026/0101801 A1
- Document ID: US20260101801A1
- Status: Published application
- Kind: A1
- Application number: 19/336,200
- Filed: 2025-09-22
- Published: 2026-04-09
- Earliest claimed: 2024-10-03
- Assignees: Micron Technology, Inc.
- Applicants: Micron Technology, Inc.
- Inventors: William M. Brewer
- Web page: https://patentgrep.com/patent/US20260101801A1

## CPC

- H10W 72/90: Bond pads, in general
- H10W 99/00: Subject matter not provided for in other groups of this subclass
- H10W 72/951: {Materials of bond pads}
- H10W 80/312: {characterised by the direct bonding of electrically conductive pads}
- H10W 80/327: {characterised by the direct bonding of insulating parts, e.g. of silicon oxide layers}
- H10W 90/792: {between multiple chips}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

Methods, systems, and devices for thermal distribution layers in stacked semiconductor architectures are described. A semiconductor system may include a first semiconductor die with first circuitry and a first dielectric material, and a second semiconductor die with second circuitry and a second dielectric material. A third dielectric material, having a higher thermal conductivity than the first and second dielectric materials, may be positioned between the first and second semiconductor dies. The third dielectric material may be in contact with the surfaces of both the first and second semiconductor dies. Conductors may be formed through the third dielectric material and may couple the first circuitry with the second circuitry. The system may include additional contacts and coating materials.

## Claims

### Claim 1

A semiconductor system, comprising:
a first semiconductor die comprising first circuitry, a surface of the first semiconductor die comprising a first dielectric material;
a second semiconductor die comprising second circuitry, a surface of the second semiconductor die comprising a second dielectric material;
a third dielectric material between the first semiconductor die and the second semiconductor die, a first surface of the third dielectric material being in contact with the surface of the first semiconductor die, a second surface of the third dielectric material opposite the first surface being in contact with the surface of the second semiconductor die, and the third dielectric material having a higher thermal conductivity than the first dielectric material and the second dielectric material; and
a plurality of conductors through the third dielectric material and coupling the first circuitry of the first semiconductor die with the second circuitry of the second semiconductor die.

### Claim 2 (depends on 1)

The semiconductor system of claim 1, further comprising:
a first plurality of contacts of the first semiconductor die that are respectively coupled with the plurality of conductors at the surface of the first semiconductor die; and
a second plurality of contacts of the second semiconductor die that are respectively coupled with the plurality of conductors at the surface of the second semiconductor die, wherein the first circuitry is coupled with the second circuitry via the first plurality of contacts and the second plurality of contacts.

### Claim 3 (depends on 1)

The semiconductor system of claim 1, wherein:
the first semiconductor die is associated with a first width dimension;
the second semiconductor die is associated with a second width dimension; and
the third dielectric material is associated with a third width dimension that extends beyond the first width dimension and the second width dimension.

### Claim 4 (depends on 3)

The semiconductor system of claim 3, further comprising:
a coating material formed around the first semiconductor die, the second semiconductor die, and the third dielectric material.

### Claim 5 (depends on 1)

The semiconductor system of claim 1, wherein:
the first dielectric material and the second dielectric material comprise silicon oxide; and
the third dielectric material comprises aluminum nitride, silicon carbide, silicon nitride, or boron arsenide.

### Claim 6 (depends on 1)

The semiconductor system of claim 1, further comprising:
a second portion of the third dielectric material in contact with a second surface of the first semiconductor die opposite the surface of the first semiconductor die; and
a third portion of the third dielectric material in contact with a second surface of the second semiconductor die opposite the surface of the second semiconductor die.

### Claim 7 (depends on 1)

The semiconductor system of claim 1, wherein a first end of at least one conductor of the plurality of conductors has a larger width than a second end of the at least one conductor.

### Claim 8 (depends on 1)

The semiconductor system of claim 1, further comprising:
a plurality of solder contacts at a second surface of the second semiconductor die opposite the surface of the second semiconductor die.

### Claim 9

A method for manufacturing a semiconductor system, comprising:
bonding a first semiconductor component with a first surface of a coupling component based at least in part on bonding a plurality of conductors of the coupling component with a plurality of first contacts of the first semiconductor component at a surface of the first semiconductor component, and on bonding a first dielectric material of the coupling component with a second dielectric material at the surface of the first semiconductor component, a first thermal conductivity of the first dielectric material being higher than a second thermal conductivity of the second dielectric material; and
bonding a second semiconductor component with a second surface of the coupling component, opposite the first surface, based at least in part on bonding the plurality of conductors of the coupling component with a plurality of second contacts of the second semiconductor component at a surface of the second semiconductor component, and on bonding the first dielectric material of the coupling component with a third dielectric material at the surface of the second semiconductor component, the first thermal conductivity of the first dielectric material being higher than a third thermal conductivity of the third dielectric material.

### Claim 10 (depends on 9)

The method of claim 9, wherein the first dielectric material bonded with the second dielectric material is contiguous with the first dielectric material bonded with the third dielectric material.

### Claim 11 (depends on 9)

The method of claim 9, wherein circuitry of the first semiconductor component is coupled with circuitry of the second semiconductor component via one or more of the plurality of conductors.

### Claim 12 (depends on 11)

The method of claim 11, wherein:
the circuitry of the first semiconductor component comprises a doped portion of a first semiconductor substrate of the first semiconductor component; and
the circuitry of the second semiconductor component comprises a doped portion of a second semiconductor substrate of the second semiconductor component.

### Claim 13 (depends on 11)

The method of claim 11, wherein:
the circuitry of the first semiconductor component comprises circuitry associated with accessing a first memory array of the first semiconductor component; and
the circuitry of the second semiconductor component comprises circuitry associated with accessing a second memory array of the second semiconductor component.

### Claim 14 (depends on 9)

The method of claim 9, further comprising:
forming the coupling component before bonding the coupling component with the first semiconductor component and the second semiconductor component, wherein forming the coupling component comprises:
forming the first dielectric material;
forming a plurality of cavities into the first surface of the first dielectric material; and
forming the plurality of conductors based at least in part on forming a conductive material in the plurality of cavities.

### Claim 15 (depends on 14)

The method of claim 14, wherein forming the coupling component further comprises:
removing a portion of the first dielectric material to expose the plurality of conductors at the second surface of the coupling component.

### Claim 16 (depends on 14)

The method of claim 14, wherein forming the coupling component further comprises:
forming a wafer comprising a plurality of dielectric materials including the first dielectric material; and
separating a plurality of coupling components including the coupling component from the wafer.

### Claim 17 (depends on 9)

The method of claim 9, further comprising:
bonding the second semiconductor component with a first surface of a second coupling component based at least in part on bonding a plurality of second conductors of the second coupling component with a plurality of third contacts of the second semiconductor component at a second surface of the second semiconductor component opposite the surface of the second semiconductor component, and on bonding the first dielectric material of the second coupling component with a fourth dielectric material at the second surface of the second semiconductor component, the first thermal conductivity of the first dielectric material being higher than a fourth thermal conductivity of the fourth dielectric material; and
bonding a third semiconductor component with a second surface of the second coupling component, opposite the first surface of the second coupling component, based at least in part on bonding the plurality of second conductors of the second coupling component with a plurality of fourth contacts of the third semiconductor component at a surface of the third semiconductor component, and on bonding the first dielectric material of the second coupling component with a fifth dielectric material at the surface of the third semiconductor component, the first thermal conductivity of the first dielectric material being higher than a fifth thermal conductivity of the fifth dielectric material.

### Claim 18 (depends on 9)

The method of claim 9, further comprising:
forming, after bonding the coupling component with the first semiconductor component and the second semiconductor component, a coating material around the first semiconductor component, the second semiconductor component, and the coupling component, the coating material having a thermal conductivity greater than the second thermal conductivity and the third thermal conductivity.

### Claim 19 (depends on 9)

The method of claim 9, wherein:
the first dielectric material comprises aluminum nitride, silicon carbide, silicon nitride, or boron arsenide; and
the second dielectric material and the third dielectric material comprise silicon oxide.

### Claim 20

A method for semiconductor device manufacture, comprising:
forming a first dielectric material over a surface of a first semiconductor component, the first semiconductor component comprising a plurality of first contacts at the surface of the first semiconductor component that are coupled with first circuitry of the first semiconductor component, and a first thermal conductivity of the first dielectric material being higher than a second thermal conductivity of a second dielectric material at the surface of the first semiconductor component;
forming a plurality of conductors through the first dielectric material and in contact with the plurality of first contacts of the first semiconductor component; and
bonding a second semiconductor component with a surface of first dielectric material opposite the first semiconductor component based at least in part on bonding the plurality of conductors with a plurality of second contacts at a surface of the second semiconductor component, and on bonding the first dielectric material with a third dielectric material at the surface of the second semiconductor component, the first dielectric material having a greater thermal conductivity than the third dielectric material.

### Claim 21 (depends on 20)

The method of claim 20, wherein forming the plurality of conductors comprises:
forming a plurality of cavities through the first dielectric material, each cavity exposing a respective first contact of the plurality of first contacts; and
forming a conductive material in the plurality of cavities.

### Claim 22 (depends on 20)

The method of claim 20, wherein circuitry of the first semiconductor component is coupled with circuitry of the second semiconductor component via one or more of the plurality of conductors.

### Claim 23 (depends on 20)

The method of claim 20, wherein forming the first dielectric material comprises:
forming a first thickness of the first dielectric material associated with respective first portions of the plurality of conductors; and
forming, after forming the first thickness and the respective first portions of the plurality of conductors, a second thickness of the first dielectric material over the first thickness, the second thickness associated with respective second portions of the plurality of conductors in contact with the respective first portions.

### Claim 24 (depends on 20)

The method of claim 20, wherein:
the first dielectric material comprises aluminum nitride, silicon carbide, silicon nitride, or boron arsenide; and
the second dielectric material and the third dielectric material comprise silicon oxide.