Method for producing an electronic component
OwnerChristoph Mannal, Mathias Wendt +1inventors
InventorsChristoph Mannal, Mathias Wendt, Klaus Müller
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Abstract
In an embodiment a method includes providing a carrier having an electronic semiconductor chip arranged on the carrier, providing a substrate having a functional layer arranged on the substrate, arranging the substrate over the carrier such that the functional layer faces toward the electronic semiconductor chip, and pressing the substrate onto the carrier, wherein the functional layer is pressed onto the electronic semiconductor chip so that the electronic semiconductor chip is pressed onto the carrier and connected to the carrier, and wherein the functional layer is deformed in response to pressing the electronic semiconductor chip.
Claims19
1-17. (canceled)
A method for producing an electronic component, the method comprising:
- providing a carrier having an electronic semiconductor chip arranged on the carrier;
- providing a substrate having a functional layer arranged on the substrate;
- arranging the substrate over the carrier such that the functional layer faces toward the electronic semiconductor chip;
- and
- pressing the substrate onto the carrier,
- wherein the functional layer is pressed onto the electronic semiconductor chip so that the electronic semiconductor chip is pressed onto the carrier and connected to the carrier, and
- wherein the functional layer is deformed in response to pressing the electronic semiconductor chip.
Dependencies are inferred from the claim text.