# US 2026/0101774 A1 · Semiconductor device and manufacturing method thereof > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2026/0101774 A1 - Document ID: US20260101774A1 - Status: Published application - Kind: A1 - Application number: 19/070,404 - Filed: 2025-03-04 - Published: 2026-04-09 - Earliest claimed: 2024-09-10 - Applicants: Kioxia Corporation - Inventors: Hideki TABARA - Web page: https://patentgrep.com/patent/US20260101774A1 ## CPC - H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) - H10W 70/611: {for connecting multiple chips together} - H10W 90/00: Package configurations - H10B 80/00: Assemblies of multiple devices comprising at least one memory device covered by this subclass - H10W 72/07202: {using auxiliary members} - H10W 72/07236: {Soldering or alloying} - H10W 72/281: {Auxiliary members} - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H10B: ELECTRONIC MEMORY DEVICES ## Abstract According to one embodiment, a semiconductor device includes a substrate, at least one semiconductor part, and a non-semiconductor part. The substrate has a first face and a second face on a side opposite to that of the first face, and has a first linear expansion coefficient. The at least one semiconductor part is disposed on a first region of the first face, and has a second linear expansion coefficient that is smaller than the first linear expansion coefficient. The non-semiconductor part is disposed on a second region of the first face, on which no semiconductor part is disposed, and has a third linear expansion coefficient that is greater than the first linear expansion coefficient. ## Claims ### Claim 1 A semiconductor device, comprising: a substrate that has a first face and a second face on a side opposite to that of the first face, and has a first linear expansion coefficient; at least one semiconductor part that is disposed on a first region of the first face and has a second linear expansion coefficient that is smaller than the first linear expansion coefficient; and a non-semiconductor part that is disposed on a second region of the first face, on which no semiconductor part is disposed, and has a third linear expansion coefficient that is greater than the first linear expansion coefficient. ### Claim 2 (depends on 1) The semiconductor device according to claim 1, wherein the non-semiconductor part is disposed in a vicinity of a center of the first face. ### Claim 3 (depends on 1) The semiconductor device according to claim 1, wherein a dimension of the non-semiconductor part in a first direction along the first face is smaller than that of the at least one semiconductor part. ### Claim 4 (depends on 3) The semiconductor device according to claim 3, wherein the non-semiconductor part has a rod shape extending along the first face in a second direction that intersects the first direction. ### Claim 5 (depends on 4) The semiconductor device according to claim 4, wherein the at least one semiconductor part includes two or more semiconductor parts arranged in the second direction, and the non-semiconductor part extends in the second direction to a length so as to oppose the two or more semiconductor parts when seen from the first direction. ### Claim 6 (depends on 1) The semiconductor device according to claim 1, wherein the non-semiconductor part is made of metal. ### Claim 7 (depends on 6) The semiconductor device according to claim 6, wherein the metal is aluminum. ### Claim 8 (depends on 1) The semiconductor device according to claim 1, wherein the substrate has wiring, and the at least one semiconductor part is electrically connected to the wiring, and the non-semiconductor part is not electrically connected to the wiring. ### Claim 9 (depends on 1) The semiconductor device according to claim 1, further comprising at least one second semiconductor part disposed on the second face. ### Claim 10 A semiconductor device, comprising: a substrate that has a first face and a second face on a side opposite to that of the first face; a plurality of first semiconductor chips mounted on the first face of the substrate and arranged on a first side of a center line that extends in a first direction through a center of the first face, wherein at least two of the first semiconductor chips are aligned in a second direction that is perpendicular to the first direction; a plurality of second semiconductor chips mounted on the first face of the substrate and arranged on a second side of the center line, wherein at least two of the second semiconductor chips are aligned in the second direction; a first non-semiconductor part mounted on the first face of the substrate on the first side of the center line and extending in the second direction; and a second non-semiconductor part mounted on the first face of the substrate on the second side of the center line and extending in the second direction, wherein a linear expansion coefficient of the first non-semiconductor part and a linear expansion coefficient of the second non-semiconductor part are each greater than a linear expansion coefficient of the substrate, and the linear expansion coefficient of the substrate is greater than a linear expansion coefficient of each of the first and second semiconductor chips. ### Claim 11 (depends on 10) The semiconductor device according to claim 10, wherein a dimension of the first non-semiconductor part in the first direction and a dimension of the second non-semiconductor part in the first direction is smaller than that of each of the first and second semiconductor chips. ### Claim 12 (depends on 11) The semiconductor device according to claim 11, wherein a height of the first non-semiconductor part above the substrate and a height of the second non-semiconductor part above the substrate is greater than that of each of the first and second semiconductor chips. ### Claim 13 (depends on 12) The semiconductor device according to claim 12, wherein the first non-semiconductor part extends in the second direction to a length so as to face the at least two first semiconductor chips aligned in the second direction, in the first direction, and the second non-semiconductor part extends in the second direction to a length so as to face the at least two second semiconductor chips aligned in the second direction, in the first direction. ### Claim 14 (depends on 13) The semiconductor device according to claim 13, wherein each of the first and second semiconductor chips and the first and second non-semiconductor parts is mounted on the first face of the substrate through a corresponding electrode and fixed to the corresponding electrode through a solder paste. ### Claim 15 (depends on 14) The semiconductor device according to claim 14, wherein the substrate has wiring, and the first and second semiconductor chips are electrically connected to the wiring, and the first and second non-semiconductor parts are not electrically connected to the wiring. ### Claim 16 (depends on 10) The semiconductor device according to claim 10, wherein the first non-semiconductor part and the second non-semiconductor part are each made of metal. ### Claim 17 A semiconductor device manufacturing method, comprising: mounting at least one semiconductor part on a first face of a substrate; and mounting a non-semiconductor part on the first face of the substrate, wherein a linear expansion coefficient of the non-semiconductor part is greater than a linear expansion coefficient of the substrate, and the linear expansion coefficient of the substrate is greater than a linear expansion coefficient of the at least one semiconductor part. ### Claim 18 (depends on 17) The semiconductor device manufacturing method according to claim 17, wherein the at least one semiconductor part and the non-semiconductor part are mounted simultaneously. ### Claim 19 (depends on 18) The semiconductor device manufacturing method according to claim 18, wherein the at least one semiconductor part and the non-semiconductor part are mounted using reflow soldering. ### Claim 20 (depends on 17) The semiconductor device manufacturing method according to claim 17, further comprising: mounting at least one second semiconductor part on a second face of the substrate that is opposite to the first face, after mounting the at least one semiconductor part and the non-semiconductor part on the first face.