# US 2026/0101697 A1 · Method and apparatus for cleaning wafer

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- Number: US 2026/0101697 A1
- Document ID: US20260101697A1
- Status: Published application
- Kind: A1
- Application number: 19/329,667
- Filed: 2025-09-16
- Published: 2026-04-09
- Earliest claimed: 2024-10-03
- Assignees: Disco Corporation
- Applicants: Disco Corporation
- Inventors: Atsushi KOMATSU; Cheng Hsiang WANG
- Web page: https://patentgrep.com/patent/US20260101697A1

## CPC

- H10P 72/0412: {using mainly scrubbing means, e.g. brushes}
- H10P 52/00: Grinding, lapping or polishing of wafers, substrates or parts of devices
- H10P 72/0414: {using mainly spraying means, e.g. nozzles}
- H10P 72/7618: {characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel}
- H10P 90/128: {by edge treatment, e.g. chamfering}
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10

## Abstract

Provided is a method for cleaning a wafer that enables sufficient removal of cutting chips from the wafer surface. The method for cleaning a wafer includes: mounting a wafer 56 on a spinner table 4 such that a rear surface of the wafer 56 faces the spinner table 4 and a front surface 56a of the wafer 56 is exposed, the spinner table 4 being rotatable while holding the wafer 56; subjecting the front surface 56a of the wafer 56 to first cleaning with cleaning water supplied to the front surface 56a of the wafer 56, while rotating the spinner table 4; and subjecting the front surface 56a of the wafer 56 to second cleaning with ammonia water supplied to the front surface 56a of the wafer 56 using a brush. [Elected View] FIG. 6

## Claims

### Claim 1

A method for cleaning a wafer that has on its front surface a device region where a plurality of devices are demarcated by a division line, the method comprising:
mounting the wafer on a spinner table such that a rear surface of the wafer faces the spinner table and a front surface of the wafer is exposed, the spinner table being rotatable while holding the wafer;
subjecting the front surface of the wafer to first cleaning with cleaning water supplied to the front surface of the wafer, while rotating the spinner table; and
subjecting the front surface of the wafer to second cleaning with ammonia water supplied to the front surface of the wafer using a brush.

### Claim 2 (depends on 1)

The method of claim 1, further comprising, after the second cleaning, subjecting the front surface of the wafer to third final cleaning with pure water supplied to the front surface of the wafer.

### Claim 3 (depends on 1)

The method of claim 1, further comprising, before the first cleaning, removing a necessary amount of chamfered portion using a cutting blade, while supplying cutting water to the chamfered portion, the chamfered portion being formed on an outer periphery of the wafer to surround the device region.

### Claim 4 (depends on 1)

A cleaning apparatus for performing the method of claim 1, the apparatus comprising:
the spinner table; a cleaning water supply unit including a cleaning nozzle that supplies the cleaning water to the front surface of the wafer held on the spinner table; and an ammonia cleaning unit that cleans the front surface of the wafer held on the spinner table with the ammonia water supplied to the front surface of the wafer using the brush.