# US 2026/0101618 A1 · Display apparatus and manufacturing method thereof

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- Number: US 2026/0101618 A1
- Document ID: US20260101618A1
- Status: Published application
- Kind: A1
- Application number: 18/953,068
- Filed: 2024-11-20
- Published: 2026-04-09
- Earliest claimed: 2024-10-07
- Assignees: AUO Corporation
- Applicants: AUO Corporation
- Inventors: To-Cheng Fan; Cheng-Chih Hsieh; Ching-Yao Shih; Wen-Wei Yang; Kuan-Heng Lin
- Web page: https://patentgrep.com/patent/US20260101618A1

## CPC

- H10H 20/855: Optical field-shaping means, e.g. lenses
- H10H 20/8506: {Containers}
- H10H 20/8514: {characterised by their shape, e.g. plate or foil}
- H10H 29/012: {of active-matrix LED displays}
- H10H 29/0361: {of wavelength conversion means}
- H10H 29/0362: {of encapsulations}
- H10H 29/0363: {of optical field-shaping means}
- H10H 29/37: Pixel-defining structures, e.g. banks between the LEDs
- H10H 29/851: Wavelength conversion means
- H10H 29/853: characterised by their shape
- H10W 90/00: Package configurations
- H10H 20/0361: {of wavelength conversion means}
- H10H 20/0363: {of optical field-shaping means}
- H10H 29/8517: {Colour filters}
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A display apparatus includes a driving circuit substrate, light-emitting elements, a color conversion structure, an encapsulation layer, an opposite substrate and a bank layer. The light-emitting elements are disposed on the driving circuit substrate and are electrically connected to the driving circuit substrate. The color conversion structure covers a first light-emitting element of the light-emitting elements. The encapsulation layer is disposed on the driving circuit substrate. The opposite substrate is disposed opposite to the driving circuit substrate. The bank layer is disposed on the opposite substrate and is located between the opposite substrate and the encapsulation layer. There is a low refractive index material between a top surface of the color conversion structure and the opposing substrate of the low refractive index material is less than or equal to 1.2. In addition, a manufacturing method of the display apparatus is also provided.

## Claims

### Claim 1

A display apparatus comprising:
a driving circuit substrate;
a plurality of light-emitting elements disposed on the driving circuit substrate and electrically connected to the driving circuit substrate;
a color conversion structure, wherein the light-emitting elements comprise a first light-emitting element, and the color conversion structure covers the first light-emitting element;
an encapsulation layer, disposed on the driving circuit substrate;
an opposite substrate disposed opposite the driving circuit substrate; and
a bank layer, disposed on the opposition substrate and located between the opposition substrate and the encapsulation layer;
the color conversion structure has a top surface facing away from the driving circuit substrate, there is a low refractive index material between the top surface of the color conversion structure and the opposite substrate, and a refractive index of the low refractive index material is less than or equal to 1.2.

### Claim 2 (depends on 1)

The display apparatus according to claim 1, wherein the color conversion structure directly covers the first light-emitting element.

### Claim 3 (depends on 1)

The display apparatus according to claim 1, wherein the refractive index of the low refractive index material is less than a refractive index of the color conversion structure and a refractive index of a first color filter pattern of the opposite substrate.

### Claim 4 (depends on 1)

The display apparatus according to claim 1, wherein the low refractive index material comprises a first air gap.

### Claim 5 (depends on 1)

The display apparatus according to claim 1, wherein the low refractive index material further exists between a side wall of the color conversion structure and a side wall of the bank layer.

### Claim 6 (depends on 1)

The display apparatus according to claim 1, wherein a distance between a side wall of the color conversion structure and a side wall of the bank layer in a direction parallel to the driving circuit substrate gradually changes as the distance moves away from the driving circuit substrate.

### Claim 7 (depends on 1)

The display apparatus according to claim 1, wherein a distance between an active layer of one of the light-emitting elements and the driving circuit substrate in a direction perpendicular to the driving circuit substrate is greater than a film thickness of the encapsulation layer in the direction.

### Claim 8 (depends on 1)

The display apparatus according to claim 1, wherein the encapsulation layer has a through hole, and the color conversion structure is disposed in the through hole.

### Claim 9 (depends on 1)

The display apparatus according to claim 1, wherein the encapsulation layer is in contact with a side wall of the color conversion structure.

### Claim 10

A manufacturing method of a display apparatus comprising:
providing a driving circuit substrate;
transferring a plurality of light-emitting elements to the driving circuit substrate and electrically connecting the light-emitting elements to the driving circuit substrate, wherein the light-emitting elements comprise a first light-emitting element;
forming a color conversion structure on the driving circuit substrate to cover the first light-emitting element, wherein the driving circuit substrate has a first region and a second region outside the first region, and the first light-emitting element and the color conversion structure is disposed in the first region of the driving circuit substrate;
forming an encapsulation layer on the second region of the driving circuit substrate, wherein the encapsulation layer exposes the color conversion structure located in the first region;
providing an opposite substrate;
forming a bank layer on the opposite substrate, wherein the bank layer has openings, and an opposite element comprises the opposite substrate and the bank layer, and a light-emitting element substrate comprises the driving circuit substrate, the light-emitting elements, the color conversion structure and the encapsulation layer; and
assembling the opposition element and the light-emitting element substrate, wherein the openings of the bank layer of the opposition element respectively correspond to the light-emitting elements of the light-emitting element substrate.

### Claim 11 (depends on 10)

The manufacturing method of the display apparatus according to claim 10, wherein the color conversion structure directly covers the first light-emitting element.

### Claim 12 (depends on 10)

The manufacturing method of the display apparatus according to claim 10, wherein the color conversion structure has a top surface facing away from the driving circuit substrate, there is a low refractive index material between the top surface of the color conversion structure and the opposite substrate, and a refractive index of the low refractive index material is less than or equal to 1.2.

### Claim 13 (depends on 12)

The manufacturing method of the display apparatus according to claim 12, wherein the refractive index of the low refractive index material is less than a refractive index of the color conversion structure and a refractive index of a first color filter pattern of the opposite substrate.

### Claim 14 (depends on 12)

The manufacturing method of the display apparatus according to claim 12, wherein the low refractive index material comprises a first air gap.

### Claim 15 (depends on 12)

The manufacturing method of the display apparatus according to claim 12, wherein the low refractive index material further exists between a side wall of the color conversion structure and a side wall of the bank layer.

### Claim 16 (depends on 10)

The manufacturing method of the display apparatus according to claim 10, wherein a distance between a side wall of the color conversion structure and a side wall of the bank layer in a direction parallel to the driving circuit substrate gradually changes as the distance moves away from the driving circuit substrate.

### Claim 17 (depends on 10)

The manufacturing method of the display apparatus according to claim 10, wherein a distance between an active layer of one of the light-emitting elements and the driving circuit substrate in a direction perpendicular to the driving circuit substrate is greater than a film thickness of the encapsulation layer in the direction.

### Claim 18 (depends on 10)

The manufacturing method of the display apparatus according to claim 10, wherein the encapsulation layer has a through hole, and the color conversion structure is disposed in the through hole.

### Claim 19 (depends on 10)

The manufacturing method of the display apparatus according to claim 10, wherein the encapsulation layer is in contact with a side wall of the color conversion structure.
