Coefficient of thermal expansion structures in submounts of light-emitting diodes
AssigneeCreeLED, Inc.
InventorsMichael Check, Colin Blakely
Life of this patent
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Abstract
Light-emitting diode (LED) devices and more particularly coefficient of thermal expansion (CTE) structures in submounts of LEDs are disclosed. Thermal expansion structures include arrangements of vias within submounts that provide variable CTE values across submount surfaces and/or within thicknesses of submounts. Vias may comprise air-filled vias and/or vias filled with various materials that provide variable CTE values. Vias may further be formed with variable thicknesses within submounts to further tailor CTE values. Submounts may include flexible submounts adept for mounting to irregular surfaces with vias structure to provide CTE compensation. Further aspects are described in the context of chip-scale packaging.
Claims28
A light-emitting diode (LED) package comprising:
- a submount;
- a first bonding pad on the submount;
- an LED chip mounted to the first bonding pad;
- and
- a first via and a second via extending through the submount and at least a portion of the first bonding pad, the first via having a first coefficient of thermal expansion that is different than a second coefficient of thermal expansion of the second via.
A light-emitting diode (LED) package comprising:
- a submount;
- a first bonding pad and a second bonding pad on a first side of the submount;
- an LED chip bonded to the first bonding pad and the second bonding pad;
- and
- a first mounting pad and a second mounting pad on a second side of the submount opposite the first side, the first mounting pad and the second mounting pad comprising tapered thicknesses on the second side of the submount.
A light-emitting diode (LED) package comprising:
- a submount;
- a first bonding pad, a second bonding pad, and a third bonding pad on a first side of the submount;
- and
- an LED chip bonded to the first bonding pad, the second bonding pad, and the third bonding pad, the LED chip being electrically connected to the first bonding pad and the second bonding pad, and the LED chip being electrically isolated from the third bonding pad.
A light-emitting diode (LED) chip comprising:
- a chip submount;
- a first bonding pad on the chip submount;
- an active LED structure bonded to the first bonding pad;
- and
- a first via and a second via extending through the chip submount and at least a portion of the first bonding pad, the first via having a first coefficient of thermal expansion that is different than a second coefficient of thermal expansion of the second via.
Dependencies are inferred from the claim text.