# US 2026/0101488 A1 · Electronic device including shielding structure for electronic component > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2026/0101488 A1 - Document ID: US20260101488A1 - Status: Published application - Kind: A1 - Application number: 19/404,429 - Filed: 2025-12-01 - Published: 2026-04-09 - Earliest claimed: 2023-07-19 - Assignees: Samsung Electronics Co., Ltd. - Applicants: Samsung Electronics Co., Ltd. - Inventors: Haejin LEE; Joseph AHN - Web page: https://patentgrep.com/patent/US20260101488A1 ## CPC - H05K 7/20445: {the coupling element being an additional piece, e.g. thermal standoff} - H05K 9/0024: {Shield cases mounted on a PCB, e.g. cans or caps or conformal shields} - G06F 1/1616: {with folding flat displays, e.g. laptop computers or notebooks having a clamshell configuration, with body parts pivoting to an open position around an axis parallel to the plane they define in closed position} - G06F 1/1626: {with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]} - G06F 1/1656: {Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories (mounting of accessories to a computer display G06F1/1607; display hoods G06F1/1603; cooling arrangements for portable computers G06F1/203)} - G06F 1/203: {for portable computers, e.g. for laptops} - H04M 1/026: {Details of the structure or mounting of specific components} - H05K 1/0203: {Cooling of mounted components (H05K1/0272 takes precedence)} - H05K 5/0226: {Hinges} - H10W 40/255: {having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates} - H10W 42/20: protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons - H05K 2201/10128: Display - H10W 40/22: characterised by their shape, e.g. having conical or cylindrical projections - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N) - H04M: TELEPHONIC COMMUNICATION (circuits for controlling other apparatus via a telephone cable and not involving telephone switching apparatus G08) - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract An electronic device according to an embodiment may comprise an electronic component and a shield can including an opening facing the electronic component. The electronic device may comprise: a shielding structure on the shield can and covering the opening; and a heat conductive member which is attached to the electronic component, is in contact with the shielding structure through the opening, and is between the electronic component and the shielding structure. The electronic device may comprise a metal plate on the shielding structure and at least one heat dissipation member attached to the metal plate. The shielding structure may include a first shielding member attached to the shield can and a second shielding member attached to the first shielding member. The density of the first shielding member may be smaller than the density of the second shielding member. ## Claims ### Claim 1 An electronic device comprising: a printed circuit board; an electronic component coupled on the printed circuit board; a shield can on the printed circuit board surrounding the electronic component and including an opening facing the electronic component; a shielding structure on the shield can covering the opening; a heat conduction member between the electronic component and the shielding structure attached on the electronic component and contacting the shielding structure through the opening; a metal plate on the shielding structure; and at least one heat dissipation member attached to the metal plate and configured to receive at least a portion of heat emitted from the electronic component through the heat conduction member, wherein the shielding structure includes: a first shielding member attached on the shield can, a first adhesive member interposed between the first shielding member and the shield can to attach the first shielding member to the shield can, a second shielding member attached on the first shielding member, and a second adhesive member interposed between the first shielding member and the second shielding member to attach the second shielding member to the first shielding member, and wherein a density of the first shielding member is smaller than a density of the second shielding member. ### Claim 2 (depends on 1) The electronic device of claim 1, wherein the shielding structure further includes a groove dent toward the metal plate from the opening to accommodate the heat conduction member. ### Claim 3 (depends on 1) The electronic device of claim 1, wherein the first shielding member surrounds at least a portion of the heat conduction member passing through the opening, and wherein the second shielding member is attached to the heat conduction member through the second adhesive member. ### Claim 4 (depends on 1) The electronic device of claim 1, wherein the metal plate includes a heat dissipation portion disposed on the electronic component, wherein the at least one heat dissipation member includes a first heat dissipation member covering at least a portion of a second surface of the metal plate opposite to the first surface of the metal plate facing the shield can, and wherein the electronic device further comprising a heat insulation member attached to the heat dissipation portion and at least partially surrounded by the first heat dissipation member. ### Claim 5 (depends on 4) The electronic device of claim 4, wherein the at least one heat dissipation member further includes a second heat dissipation member disposed on the first heat dissipation member and the heat insulation member and covering the heat insulation member. ### Claim 6 (depends on 1) The electronic device of claims claim 1, wherein the first shielding member includes: a first region including an adhesive material from the first adhesive member, and a second region including an adhesive material from the second adhesive member, and, wherein at least a portion of one surface of the first shielding member facing the second shielding member contact with the second shielding member. ### Claim 7 (depends on 1) The electronic device of claim 1, wherein a thickness of the first shielding member is located in a range of 70μm or more and 80 μm or less, and wherein a thickness of the second shielding member is located in a range of 10μm or more and 20μm or less. ### Claim 8 (depends on 1) The electronic device of claim 1, wherein the heat dissipation member includes at least one of rubber, paraffin wax, and oil. ### Claim 9 (depends on 1) The electronic device of claim 1, wherein the metal plate includes a recess bent toward the heat conduction member from the second surface of the metal plate opposite to the first surface of the metal plate facing the shield can, and, wherein the at least one heat dissipation member disposed in the recess so that overlaps the electronic component when viewing the metal plate from above. ### Claim 10 (depends on 1) The electronic device of claim 1, wherein the at least one heat dissipation member includes a third heat dissipation member attached to the shielding structure and covering at least a portion of the first surface of the metal plate facing the shield can. ### Claim 11 (depends on 10) The electronic device of claim 10, further comprising: a heat insulation member at least partially surrounded by the third heat dissipation member, wherein the metal plate includes a heat dissipation portion disposed on the electronic component and to which the heat insulation member is attached, and wherein the at least one heat dissipation member further includes a fourth heat dissipation member disposed on the third heat dissipation member and the heat insulation member and covering the heat insulation member. ### Claim 12 (depends on 1) The electronic device of claim 1, wherein the at least one heat dissipation member includes at least one of vapor chamber, heat pipe, graphite, and graphene. ### Claim 13 (depends on 1) The electronic device of claim 1, wherein a thickness of the first adhesive member and a thickness of the second adhesive member are located in a range of 1μm or more and 15μm or less, respectively. ### Claim 14 (depends on 1) The electronic device of claim 1, wherein the shielding structure further includes a protection member disposed on the second shielding member. ### Claim 15 (depends on 1) The electronic device of claim 1, further comprising: a display on the metal plate including a first display region, a second display region spaced apart from the first display region, and a third display region which is foldable based on a folding axis connecting the first display region and the second display region; a first housing supporting the first display region; a second housing supporting the second display region; and a hinge structure configured to deform the third display region by rotatably coupling the first housing and the second housing. ### Claim 16 An electronic device comprising: a printed circuit board; an electronic component coupled on the printed circuit board; a shield can on the printed circuit board surrounding the electronic component and including an opening facing the electronic component; a shielding structure on the shield can covering the opening; a heat conduction member between the electronic component and the shielding structure attached on the electronic component and contacting the shielding structure through the opening; a metal plate on the shielding structure; and at least one heat dissipation member attached to the metal plate and configured to receive at least a portion of heat emitted from the electronic component through the heat conduction member, wherein the shielding structure includes: a first shielding member attached on the shield can, a first adhesive member interposed between the first shielding member and the shield can to attach the first shielding member to the shield can, a second shielding member attached on the first shielding member, a second adhesive member interposed between the first shielding member and the second shielding member to attach the second shielding member to the first shielding member, a protection member disposed on the second shielding member, and a groove dent toward the metal plate from the opening to accommodate the heat conduction member, and wherein a density of the first shielding member is smaller than a density of the second shielding member. ### Claim 17 (depends on 16) The electronic device of claim 16, wherein the first shielding member includes: a first region including an adhesive material from the first adhesive member, and a second region including an adhesive material from the second adhesive member, and, wherein, at least a portion of one surface of the first shielding member facing the second shielding member contact with the second shielding member. ### Claim 18 (depends on 16) The electronic device of claim 16, wherein the heat dissipation member includes at least one of rubber, paraffin wax, and oil. ### Claim 19 (depends on 16) The electronic device of claim 16, wherein the metal plate includes a heat dissipation portion disposed on the electronic component, wherein the at least one heat dissipation member includes a first heat dissipation member covering at least a portion of a second surface of the metal plate opposite to the first surface of the metal plate facing the shield can, and wherein the electronic device further comprising a heat insulation member attached to the heat dissipation portion and at least partially surrounded by the first heat dissipation member. ### Claim 20 (depends on 19) The electronic device of claim 19, wherein the at least one heat dissipation member further includes a second heat dissipation member disposed on the first heat dissipation member and the heat insulation member and covering the heat insulation member.