# US 2026/0101481 A1 · Heat dissipation device and manufacturing method therefor > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2026/0101481 A1 - Document ID: US20260101481A1 - Status: Published application - Kind: A1 - Application number: 19/417,666 - Filed: 2025-12-12 - Published: 2026-04-09 - Earliest claimed: 2022-08-31 - Assignees: Purple Cloud Development Pte. Ltd. - Applicants: Purple Cloud Development Pte. Ltd. - Inventors: Xue Mei WANG; Xiao Min ZHANG; Xianyao LIU - Web page: https://patentgrep.com/patent/US20260101481A1 ## CPC - H05K 7/2039: {characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00)} - H05K 7/20336: {Heat pipes, e.g. wicks or capillary pumps} - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract A heat dissipation device includes a thermally-conductive base that defines a heat absorbing surface and a heat dissipation surface opposite to the heat absorbing surface. The thermally-conductive base includes a plurality of accommodation holes extending between the heat absorbing surface and the heat dissipation surface. The heat dissipation device further includes a plurality of heat pipes each being disposed within a respective accommodation hole. Each of the heat pipes includes a first surface and a second surface that faces away from the first surface. The first surface and the heat dissipation surface being directly connected to each other and are substantially coplanar. The heat absorbing surface includes a thermal contact region configured for direct thermal engagement with the heat source and a peripheral region extending beyond the thermal contact region. The heat pipes distributed between the thermal contact region and the peripheral region in unequal numbers. ## Claims ### Claim 1 A heat dissipation device, comprising: a thermally-conductive base having a heat absorbing surface and a heat dissipation surface opposite to the heat absorbing surface, the heat absorbing surface being thermally coupled to a heat source, the thermally-conductive base including a plurality of accommodation holes that extend between the heat absorbing surface and the heat dissipation surface; and a plurality of heat pipes each being respectively disposed within a corresponding accommodation hole, each of the plurality of heat pipes including a first surface and a second surface that faces away from the first surface, the first surface and the heat dissipation surface being directly connected to one another and substantially coplanar, wherein the heat absorbing surface includes a thermal contact region configured for direct thermal engagement with the heat source and a peripheral region extending from the thermal contact region, with the heat pipes distributed between the thermal contact region and the peripheral region in unequal numbers. ### Claim 2 (depends on 1) The heat dissipation device according to claim 1, wherein the second surfaces of the heat pipes and the heat absorbing surface are directly connected to one another and substantially coplanar. ### Claim 3 (depends on 1) The heat dissipation device according to claim 1, further comprising a heat exchanger, wherein the heat exchanger is disposed on the heat dissipation surface of the thermally-conductive base. ### Claim 4 (depends on 3) The heat dissipation device according to claim 3, further comprising a thermally-conductive layer, wherein the thermally-conductive layer is disposed on the heat dissipation surface of the thermally-conductive base, the heat exchanger is disposed on the thermally-conductive layer, and a thermal conductivity of the thermally-conductive layer is greater than a thermal conductivity of the thermally-conductive base. ### Claim 5 (depends on 3) The heat dissipation device according to claim 3, wherein the heat exchanger is a fin assembly. ### Claim 6 (depends on 1) The heat dissipation device according to claim 1, wherein a distance between the first surface of the heat pipe and the heat dissipation surface in a thickness direction is less than 0.05 mm. ### Claim 7 (depends on 1) The heat dissipation device according to claim 1, wherein the heat pipes have a nonuniform spacing in the thermally-conductive base. ### Claim 8 (depends on 1) The heat dissipation device according to claim 1, wherein cross sections of the heat pipes are all quadrilateral in shape. ### Claim 9 (depends on 1) The heat dissipation device according to claim 1, wherein each of the heat pipes has a capillary structure therein. ### Claim 10 (depends on 9) The heat dissipation device according to claim 9, wherein the capillary structure is quadrilateral in shape. ### Claim 11 A manufacturing method for a heat dissipation device, comprising: forming a thermally-conductive base that includes a heat absorbing surface and a heat dissipation surface opposite to the heat absorbing surface, the heat absorbing surface being thermally coupled to a heat source, the thermally-conductive base including a plurality of accommodation holes that extend between the heat absorbing surface and the heat dissipation surface; disposing a plurality of heat pipes within the accommodation holes, respectively, each of the heat pipes including a first surface and a second surface that faces away from the first surface, wherein the heat absorbing surface includes a thermal contact region configured for direct thermal engagement with the heat source and a peripheral region extending from the thermal contact region, with the heat pipes distributed between the thermal contact region and the peripheral region in unequal numbers; performing a first mechanical processing procedure to squeeze the heat pipes to flatten the first surfaces of the heat pipes relative to a heat dissipation surface of the thermally-conductive base; and performing a second mechanical processing procedure to abrade the heat dissipation surface of the thermally-conductive base and the first surfaces of the heat pipes to make the first surfaces of the heat pipes and the heat dissipation surface of the thermally-conductive base directly connected to one another and substantially coplanar. ### Claim 12 (depends on 11) The manufacturing method according to claim 11, wherein the heat pipes are arranged with nonuniform spacing. ### Claim 13 (depends on 11) The manufacturing method according to claim 11, further comprising: stacking a heat exchanger on the heat dissipation surface of the thermally-conductive base and the first surface of the heat pipes. ### Claim 14 (depends on 13) The manufacturing method according to claim 13, wherein the heat exchanger is a fin assembly. ### Claim 15 (depends on 11) The manufacturing method according to claim 11, further comprising: stacking a thermally-conductive layer on the heat dissipation surface of the thermally-conductive base and the first surfaces of the heat pipes, and stacking a heat exchanger on the thermally-conductive layer. ### Claim 16 (depends on 11) The manufacturing method according to claim 11, wherein the first mechanical processing procedure further comprises squeezing the heat pipes to flatten second surfaces of the heat pipes relative to a heat absorbing surface of the thermally-conductive base; and the second mechanical processing procedure further comprises abrading the heat absorbing surface of the thermally-conductive base and the second surfaces of the heat pipes to make the second surfaces of the heat pipes and the heat absorbing surface of the thermally-conductive base directly connected to one another and substantially coplanar. ### Claim 17 (depends on 16) The manufacturing method according to claim 16, wherein cross sections of the heat pipes are all quadrilateral in shape. ### Claim 18 (depends on 17) The manufacturing method according to claim 17, wherein the abrasion depth in the second mechanical processing procedure is smaller than or equal to 0.2 mm. ### Claim 19 (depends on 11) The manufacturing method according to claim 11, wherein an abrasion depth in the second mechanical processing procedure is equal to or greater than 0.05 mm. ### Claim 20 (depends on 11) The manufacturing method according to claim 11, wherein a distance between the first surface of each heat pipe and the heat dissipation surface in a thickness direction is less than 0.05 mm.