# US 2026/0101475 A1 · Enclosed Liquid Cooling System > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2026/0101475 A1 - Document ID: US20260101475A1 - Status: Published application - Kind: A1 - Application number: 19/047,555 - Filed: 2025-02-06 - Published: 2026-04-09 - Earliest claimed: 2024-10-06 - Assignees: Liquacool IP LLC - Applicants: LiquaCool IP LLC - Inventors: Clas Sivertsen - Web page: https://patentgrep.com/patent/US20260101475A1 ## CPC - H05K 7/203: {by immersion} - H10W 40/47: by flowing liquids, e.g. forced water cooling - H05K 1/0203: {Cooling of mounted components (H05K1/0272 takes precedence)} - H05K 1/0272: {Adaptations for fluid transport, e.g. channels, holes} - H05K 5/061: {sealed by a gasket held between a removable cover and a body, e.g. O-ring, packing} - H05K 7/20236: {by immersion} - H05K 7/20327: {Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds} - H05K 7/20381: {Thermal management, e.g. evaporation control} - H05K 7/20409: {Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing} - H05K 7/20772: {within server blades for removing heat from heat source} - H10W 40/30: wherein the packaged device is completely immersed in a fluid other than air, e.g. immersed in a cryogenic fluid - H05K 2201/064: Fluid cooling, e.g. by integral pipes - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A liquid cooling system comprising a printed circuit board, a gasket seated on a top side of the printed circuit board gasket encircling one or more components on the printed circuit board, an enclosure on the gasket and fastened against the printed circuit board to form a sealed chamber, and a transfer liquid within the sealed chamber contacting one or more components mounted on the printed circuit board to provide cooling for the one or more components. ## Claims ### Claim 1 A liquid cooling system comprising: a printed circuit board; a gasket seated on a top side of the printed circuit board, the gasket encircling one or more components mounted on the printed circuit board; a silkscreened pattern printed on the printed circuit board for positioning the gasket; wherein the gasket is placed on the silkscreened pattern, with the silkscreened pattern used for positioning the gasket and the gasket is sealed against the silkscreened pattern; an enclosure seated on the gasket and fastened against the printed circuit board to form a sealed chamber with the printed circuit board and the gasket; a transfer liquid within the sealed chamber and contacting the one or more components mounted on the printed circuit board. ### Claim 2 (depends on 1) The liquid cooling system of claim 1, wherein the enclosure comprises: a first component on the top side of the printed circuit board, the first component seated on the gasket; and a second component on a bottom side of the printed circuit board, the second component seated on a second gasket. ### Claim 3 (depends on 2) The liquid cooling system of claim 2, further comprising: one or more liquid flow-holes in the printed circuit board dimensioned to enable circulation of the transfer liquid between the top side and the bottom side of the printed circuit board. ### Claim 4 (depends on 1) The liquid cooling system of claim 1, wherein there are one or more additional components on the printed circuit board outside the enclosure. ### Claim 5 (depends on 4) The liquid cooling system of claim 4, wherein the one or more additional components include input/output (I/O) components. ### Claim 6 (depends on 1) The liquid cooling system of claim 1, further comprising: the enclosure comprising a first compartment and a second compartment, the first compartment surrounded by the gasket to provide the sealed enclosure, and the second compartment not being leakproof. ### Claim 7 (depends on 1) The liquid cooling system of claims 1, wherein the transfer liquid comprises a two-phase liquid and is in both liquid and gas phases in the chamber. ### Claim 8 (canceled) ### Claim 9 (depends on 1) The liquid cooling system of claim 1, further comprising: a silkscreened pattern on the printed circuit board for positioning the gasket; wherein the silkscreened pattern is on one or both lateral sides of the gasket and the gasket contacts the printed circuit board without the silkscreened pattern being located between the gasket and the printed circuit board. ### Claim 10 (depends on 1) The liquid cooling system of claim 1, wherein the component comprises an integrated circuit having a component package and contacts, the system further comprising: inter-chip liquid flow-holes in the printed circuit board under the integrated circuit to allow the transfer liquid to pass through the printed circuit board to a volume under the integrated circuit. ### Claim 11 (depends on 1) The liquid cooling system of claim 1, wherein the component comprises an integrated circuit having a die within a component package and contacts, the system further comprising: an enclosed liquid through-hole in the component package configured to allow the transfer liquid to pass through the component package and remove heat from the die. ### Claim 12 (depends on 1) The liquid cooling system of claim 1, further comprising: an active liquid driver configured to promote movement of the transfer liquid within the enclosure; wherein the liquid driver is one or more of: an integrated micropump within the enclosure configured to actively circulate the transfer liquid, a vibration motor within the enclosure to create mechanical agitation, a small submerged fan or propeller, a thermoelectric cooler (TEC) within the enclosure to create a temperature gradient, promoting fluid movement through thermal cycling, a speaker to generate acoustic waves, and a piezoelectric buzzer to create ultrasonic vibrations, promoting the movement of the transfer liquid. ### Claim 13 (depends on 12) The liquid cooling system of claim 12, further comprising: a motor with a propeller attached to a shaft designed to generate liquid flow within the enclosure, thereby enhancing a distribution of heat from the one or more components. ### Claim 14 A method of using an enclosed liquid cooling system comprising: printing a silkscreened pattern on the printed circuit board; placing a gasket on a printed circuit board, encircling a portion of the printed circuit board wherein the gasket is placed on the silkscreened pattern, with the silkscreened pattern providing positioning and the gasket sealed against the silkscreened pattern for sealing for the gasket; seating an enclosure over the gasket and fastening the enclosure against the printed circuit board to form a chamber between the printed circuit board, the gasket and the enclosure forming a sealed chamber; and filling the chamber with a transfer liquid. ### Claim 15 (depends on 14) The method of claim 14, further comprising: placing a plurality of liquid flow-holes in the printed circuit board, such that the transfer liquid can flow between a bottom portion of the enclosure on a bottom of the printed circuit board and a top portion of the enclosure on a top of the printed circuit board through the liquid flow-holes. ### Claim 16 (depends on 14) The method of claim 14, wherein the enclosure has a first side and a second side, the method further comprising: placing a first component on a top side of the printed circuit board, the first side seated on the gasket; and placing a second component on a bottom side of the printed circuit board, the second side seated on a second gasket. ### Claim 17 (depends on 14) The method of claim 14, wherein there are one or more additional components on the printed circuit board outside the enclosure. ### Claim 18 (depends on 14) The method of claim 14, wherein the transfer liquid comprises a two-phase liquid and is in both liquid and gas phases in the chamber. ### Claim 19 (canceled) ### Claim 20 (depends on 14) The method of claim 14, further comprising: placing an active liquid driver into the enclosure, the active liquid driver configured to promote movement of the transfer liquid within the enclosure; wherein the liquid driver is one or more of: an integrated micropump within the enclosure configured to actively circulate the transfer liquid, a vibration motor within the enclosure to create mechanical agitation, a small submerged fan or propeller, a thermoelectric cooler (TEC) within the enclosure to create a temperature gradient, promoting fluid movement through thermal cycling, a speaker to generate acoustic waves, and a piezoelectric buzzer to create ultrasonic vibrations, promoting the movement of the transfer liquid. ### Claim 21 (depends on 15) The method of claim 15, wherein one or more of the plurality of liquid flow-holes are inter-chip liquid flow-holes underneath a component on the printed circuit board. ### Claim 22 A liquid cooling system comprising: a substrate including a plurality of components and a silkscreened pattern printed on the substrate for the liquid cooling system; an enclosure placed on the silkscreened pattern on the substrate enclosing one or more of the plurality of components; a gasket positioned on the silkscreened pattern between the substrate and the enclosure, with the silkscreened pattern providing positioning and sealing with the gasket for the enclosure, the enclosure thereby forming a leakproof chamber filled with a transfer fluid to cool the one or more of the plurality of components within the enclosure.