# US 2026/0101437 A1 · Base material for mounting electronic device

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- Number: US 2026/0101437 A1
- Document ID: US20260101437A1
- Status: Published application
- Kind: A1
- Application number: 19/414,932
- Filed: 2025-12-10
- Published: 2026-04-09
- Earliest claimed: 2023-06-15
- Assignees: Toyo Seikan Group Holdings, Ltd.
- Applicants: Toyo Seikan Group Holdings, Ltd.
- Inventors: Shinpei OKUYAMA; Yusuke OBU; Kenji HAYASHI
- Web page: https://patentgrep.com/patent/US20260101437A1

## CPC

- B32B 15/08: of synthetic resin
- H05K 1/036: {Multilayers with layers of different types}
- B32B 7/06: permitting easy separation
- B32B 7/12: using interposed adhesives or interposed materials with bonding properties
- B32B 15/082: comprising vinyl resins; comprising acrylic resins
- B32B 15/085: comprising polyolefins
- B32B 15/088: comprising polyamides
- B32B 15/09: comprising polyesters
- B32B 15/18: comprising iron or steel {(B32B15/011, B32B15/012 and B32B15/013 take precedence)}
- B32B 15/20: comprising aluminium or copper {(B32B15/016 and B32B15/017 take precedence)}
- B32B 27/08: of synthetic resin
- B32B 27/20: using fillers, pigments, thixotroping agents
- B32B 27/281: {comprising polyimides}
- B32B 27/283: {comprising polysiloxanes}
- B32B 27/304: {comprising vinyl halide (co)polymers, e.g. PVC, PVDC, PVF, PVDF}
- B32B 27/306: {comprising vinyl acetate or vinyl alcohol (co)polymers}
- B32B 27/308: {comprising acrylic (co)polymers}
- B32B 27/32: comprising polyolefins {(comprising vinyl (co)polymers or acrylic (co)polymers B32B27/30)}
- B32B 27/325: {comprising polycycloolefins}
- B32B 27/34: comprising polyamides
- B32B 27/36: comprising polyesters
- B32B 27/365: {comprising polycarbonates}
- B32B 27/40: comprising polyurethanes
- B32B 2250/05: 5 or more layers
- B32B 2255/06: on metal layer
- B32B 2255/10: on synthetic resin layer or on natural or synthetic rubber layer
- B32B 2255/20: Inorganic coating
- B32B 2255/26: Polymeric coating
- B32B 2264/102: Oxide or hydroxide
- B32B 2307/306: Resistant to heat
- B32B 2307/71: Resistive to light or to UV
- B32B 2307/712: Weather resistant
- B32B 2307/7246: Water vapor barrier
- B32B 2307/728: Hydrophilic
- B32B 2307/732: Dimensional properties
- B32B 2307/7376: Thickness
- B32B 2311/24: Aluminium
- B32B 2457/00: Electrical equipment
- B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

A base material for mounting an electronic device, the base material including a metal foil and a protective resin layer, in which the protective resin layer is provided on a surface of the metal foil on one side, a surface of the metal foil on the other side is a surface on a side on which the electronic device is mounted, and a hygroscopic resin layer is provided on the surface of the metal foil on the other side.

## Claims

### Claim 1

A base material for mounting an electronic device, the base material comprising:
a metal foil; and
a protective resin layer,
wherein
the protective resin layer is provided on a surface of the metal foil on one side,
a surface of the metal foil on the other side is a surface on a side on which the electronic device is mounted, and
a hygroscopic resin layer is provided on the surface of the metal foil on the other side.

### Claim 2 (depends on 1)

The base material for mounting an electronic device according to claim 1, wherein the metal foil has a thickness of from 5 to 20 μm.

### Claim 3 (depends on 1)

The base material for mounting an electronic device according to claim 1, wherein the metal foil is formed of aluminum.

### Claim 4 (depends on 1)

The base material for mounting an electronic device according to claim 1, wherein the protective resin layer is formed of a polycarbonate resin, a silicone resin, a polyester resin, a fluorine-based resin, or an acrylic resin.

### Claim 5 (depends on 1)

The base material for mounting an electronic device according to claim 1, wherein the hygroscopic resin layer is formed of an olefin-based resin in which a desiccant is dispersed.

### Claim 6 (depends on 5)

The base material for mounting an electronic device according to claim 5, wherein the desiccant is an agent of a type that chemically captures moisture by reaction with water.

### Claim 7 (depends on 1)

The base material for mounting an electronic device according to claim 1, wherein an inner surface resin layer is provided on at least one surface of the hygroscopic resin layer.

### Claim 8 (depends on 7)

The base material for mounting an electronic device according to claim 7, wherein the inner surface resin layer is formed of a polyester resin, a polyamide resin, an olefin-based resin, or a cyclic olefin-based resin.

### Claim 9 (depends on 8)

The base material for mounting an electronic device according to claim 8, wherein adjacent two of the metal foil, the protective resin layer, the hygroscopic resin layer, and the inner surface resin layer are bonded to each other with a dry laminate adhesive.

### Claim 10 (depends on 9)

The base material for mounting an electronic device according to claim 9, wherein the dry laminate adhesive is formed of a urethane-based resin or an epoxy-based resin.

### Claim 11 (depends on 1)

The base material for mounting an electronic device according to claim 1, wherein an ultraviolet blocking layer is provided on a surface of the protective resin layer on a side opposite to a surface on the side on which the electronic device is mounted.

### Claim 12 (depends on 1)

The base material for mounting an electronic device according to claim 1, having a total thickness of from 75 to 300 μm.

### Claim 13 (depends on 7)

The base material for mounting an electronic device according to claim 7, wherein the hygroscopic resin layer or the inner surface resin layer is disposed to face an inside of the device, and is used.

### Claim 14 (depends on 1)

The base material for mounting an electronic device according to claim 1, wherein a pressure-sensitive adhesive layer formed of a hot-melt pressure-sensitive adhesive is provided on a surface of the hygroscopic resin layer on the side on which the electronic device is mounted.

### Claim 15 (depends on 14)

The base material for mounting an electronic device according to claim 14, wherein the hot-melt pressure-sensitive adhesive is formed of an olefin-based resin or a cyclic olefin-based resin.