# US 2026/0101431 A1 · Printed circuit board arrangement > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2026/0101431 A1 - Document ID: US20260101431A1 - Status: Published application - Kind: A1 - Application number: 19/350,271 - Filed: 2025-10-06 - Published: 2026-04-09 - Earliest claimed: 2024-10-07 - Applicants: Rolls-Royce Deutschland Ltd & Co KG - Inventors: Uwe WALTRICH; Niklas SCHAMBERGER; Marco BOHLLÄNDER; Maria BØE - Web page: https://patentgrep.com/patent/US20260101431A1 ## CPC - H05K 1/021: {Components thermally connected to metal substrates or heat-sinks by insert mounting} - H05K 7/209: {Heat transfer by conduction from internal heat source to heat radiating structure (H05K7/20909 takes precedence)} - H05K 1/0277: {Bendability or stretchability details (H05K1/038, H05K3/4691 take precedence)} - H05K 7/2049: {Pressing means used to urge contact, e.g. springs} - H10W 40/60: Securing means for detachable heating or cooling arrangements, e.g. clamps - H10W 40/611: {Bolts or screws} - H05K 2201/066: Heatsink mounted on the surface of the printed circuit board [PCB] - H05K 2201/10393: Clamping a component by an element or a set of elements - H05K 2201/10409: Screws - H05K 2201/10522: Adjacent components - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A printed circuit board assembly comprising a printed circuit board having a top side and an underside, electrical modules having a top side and an underside, a heat sink that is thermally coupled with the underside of the electrical modules, and a hold-down device. The heat sink has a structured top side that includes a plurality of cavities and bearing structures arranged between the cavities and forming a bearing surface for the printed circuit board. The underside of the printed circuit board lies on the bearing surface and the region of the underside that is lying on the bearing surface forms a bottom abutment surface, the electrical modules project into the cavities of the heat sink, and the hold-down device has projecting structures against the top side of the printed circuit board at contact points located opposite the bottom abutment surface and apply a hold-down force to the contact points. ## Claims ### Claim 1 A printed circuit board assembly comprising: a printed circuit board having a top side and an underside; electrical modules having a top side and an underside, wherein the top side of the electrical modules are arranged on the underside of the printed circuit board; a heat sink that is thermally coupled with the underside of the electrical modules; and a hold-down device, wherein the heat sink has a structured top side comprising cavities and bearing structures arranged between the cavities and forming a bearing surface for the printed circuit board, wherein the underside of the printed circuit board lies on the bearing surface, wherein the region of the underside that is lying on the bearing surface forms a bottom abutment surface, wherein the electrical modules project into the cavities of the heat sink, and wherein the hold-down device has projecting structures that lie against the top side of the printed circuit board at contact points located opposite the bottom abutment surface and apply a hold-down force to the contact points. ### Claim 2 (depends on 1) The printed circuit board assembly of claim 1, wherein the projecting structures are on an underside of the hold-down device, and wherein the hold-down device is arranged on the top side of the printed circuit board and the projecting structures lie against the contact points of the top side. ### Claim 3 (depends on 1) The printed circuit board assembly of claim 1, wherein the hold-down device has a mechanical rigidity that is greater than a mechanical rigidity of the printed circuit board. ### Claim 4 (depends on 3) The printed circuit board assembly of claim 3, wherein the hold-down device comprises elements that have a form of a T-beam or double-T-beam. ### Claim 5 (depends on 1) The printed circuit board assembly of claim 1, wherein an edge region of the hold-down device lies on the heat sink. ### Claim 6 (depends on 1) The printed circuit board assembly of claim 1, wherein the hold-down device is screwed to the heat sink only in an edge region of the hold-down device. ### Claim 7 (depends on 1) The printed circuit board assembly of claim 1, wherein the hold-down device comprises a metallic material. ### Claim 8 (depends on 1) The printed circuit board assembly of claim 1, further comprising: a cover that presses the hold-down device against an edge region of the heat sink. ### Claim 9 (depends on 8) The printed circuit board assembly of claim 8, wherein the cover has projecting structures that lie against points on the top side of the hold-down device that are arranged opposite projecting structures on the underside of the hold-down device. ### Claim 10 (depends on 8) The printed circuit board assembly of claim 8, wherein the cover has projecting structures, wherein the cover is arranged on the top side of the printed circuit board, and wherein the projecting structures of the cover lie against the contact points of the top side of the printed circuit board. ### Claim 11 (depends on 1) The printed circuit board assembly of claim 1, wherein the projecting structures have an oversize such that the projecting structures exert a contact pressure on the top side of the printed circuit board in the assembled state of the printed circuit board assembly. ### Claim 12 (depends on 1) The printed circuit board assembly of claim 1, wherein the projecting structures are of a resilient form. ### Claim 13 (depends on 1) The printed circuit board assembly of claim 1, wherein resilient elements are formed in the region of the bearing surfaces of the heat sink. ### Claim 14 (depends on 1) The printed circuit board assembly of claim 1, wherein a heat-conducting material is arranged in the cavities of the heat sink between the underside of the electrical modules and the top side of the heat sink. ### Claim 15 (depends on 1) The printed circuit board assembly of claim 1, wherein the contact points of the top side of the printed circuit board, which lie against points of the projecting structures, are mechanically reenforced, and/or wherein the abutment surface of the underside of the printed circuit board, which lies on the bearing surface of the structured top side of the heat sink, is mechanically reinforced. ### Claim 16 (depends on 15) The printed circuit board assembly of claim 15, wherein a respective mechanical reinforcement of the contact points and/or abutment surface is formed by at least one top metal pad and at least one bottom metal pad. ### Claim 17 (depends on 16) The printed circuit board assembly of claim 16, wherein the respective mechanical reinforcement is formed by at least two metal pads, and wherein the at least two metal pads are connected by metallic vias. ### Claim 18 (depends on 1) The printed circuit board assembly of claim 1, wherein the projecting structures are formed by pins or webs. ### Claim 19 (depends on 1) The printed circuit board assembly of claim 1, wherein the pressure points on the top side of the printed circuit board are circular in form. ### Claim 20 (depends on 1) The printed circuit board assembly of claim 1, wherein the bearing structures of the structured top side of the heat sink are formed by webs.