# US 2026/0100552 A1 · Method for reducing parasitic inductance or parasitic capacitance and applications of conductive coating

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- Number: US 2026/0100552 A1
- Document ID: US20260100552A1
- Status: Published application
- Kind: A1
- Application number: 19/352,122
- Filed: 2025-10-07
- Published: 2026-04-09
- Earliest claimed: 2024-10-07
- Assignees: HAO-SHENG Technology Co., Ltd.
- Applicants: HAO-SHENG Technology Co., Ltd.
- Inventors: Shi-Wei CHEN; Qing-Feng HUANG
- Web page: https://patentgrep.com/patent/US20260100552A1

## CPC

- C09D 5/24: Electrically-conducting paints {(conductive materials H01B1/00)}
- H01R 43/00: Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors (of trolley lines B60M1/28)
- H01B 1/04: mainly consisting of carbon-silicon compounds, carbon or silicon
- H01B 1/12: organic substances {(organic macromolecular compounds or compositions C08)}
- H01B 1/22: the conductive material comprising metals or alloys
- H01B 1/24: the conductive material comprising carbon-silicon compounds, carbon or silicon
- C09D: COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR (cosmetics A61K; processes for applying liquids or other fluent materials to surfaces, in general, B05D; staining wood B27K5/02; glazes or vitreous enamels C03C; natural resins, French polish, drying-oils, driers, turpentine, per se, C09F; polishing compositions other than French polish, ski waxes C09G; adhesives or use of materials as adhesives C09J; materials for sealing or packing joints or covers C09K3/10; materials for stopping leaks C09K3/12; processes for the electrolytic or electrophoretic production of coatings C25D)
- H01R: ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01B: CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES (selection for magnetic properties H01F1/00; waveguides H01P {; printed circuits H05K})

## Abstract

A method of reducing parasitic inductance or parasitic capacitance of the present invention is to apply conductive paint to the contacts where electricity is transmitted. Through the method of the present invention, the parasitic inductance or parasitic capacitance can be reduced, and the operation method is simple, without changing the circuit design or adding any electronic circuit components, and can greatly improve the performance and stability of power transmission.

## Claims

### Claim 1

A method for reducing parasitic inductance or parasitic capacitance, comprising applying a conductive coating to a metallic contact point along a current path.

### Claim 2 (depends on 1)

The method of claim 1, wherein the conductive coating comprises a carbon-based polymer material.

### Claim 3 (depends on 1)

The method of claim 1, wherein the conductive coating is applied using a plastic brush or an animal-hair brush.

### Claim 4 (depends on 3)

The method of claim 3, wherein the conductive coating is applied at room temperature, beginning from the uppermost metallic contact point and proceeding downward, so that all air-exposed surfaces of the metallic contact are coated.

### Claim 5 (depends on 1)

The method of claim 1, wherein a conductive coating layer of at least 1 μm thickness remains adhered to the metallic contact point after application.

### Claim 6 (depends on 1)

The method of claim 1, wherein the conductive coating is in liquid or paste form.

### Claim 7

A use of a conductive coating, comprising applying the conductive coating at room temperature to a surface of a metallic contact point to reduce parasitic inductance or parasitic capacitance.

### Claim 8 (depends on 7)

The use of claim 7, wherein the conductive coating is applied to the metallic contact surface at a thickness of 1μm to 1 mm.

### Claim 9 (depends on 7)

The use of claim 7, wherein the conductive coating is in liquid or paste form.