Antenna module implemented in multi-layered package
AssigneeLG Electronics Inc.
InventorsYusuhk SUH, Dongik LEE
Life of this patent
Estimating the term…
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AssigneeLG Electronics Inc.
InventorsYusuhk SUH, Dongik LEE
Estimating the term…
Provided is an antenna module including a printed circuit board (PCB), and an array antenna portion arranged on a first outermost surface of the PCB, and including first and second array antennas arranged in a first region and a second region based on a first axial direction. The first array antenna may include first and second patch antennas which are stacked to overlap each other. The second array antenna may include third and fourth patch antennas which are stacked to overlap each other. The first and third patch antennas arranged on the first outermost surface may be arranged spaced apart at a first gap in a second axial direction. First and second groups of the fourth patch antennas arranged in third and fourth regions in the second axial direction may be arranged spaced apart at a second gap along the second axial direction.
An antenna module implemented in a multi-layered package, the antenna module comprising:
Dependencies are inferred from the claim text.