Structure increasing solidity for side-mounted antenna

A structure increasing a solidity for a side-mounted antenna comprising:

• an antenna structure, a mainboard, a first solder pad, and a second solder pad, wherein the antenna structure comprises:
• a circuit board being a square body comprising a front surface, a back surface, a top surface, a bottom surface, and two side surfaces;
• an electrode layer comprising a first electrode layer and a second electrode layer, wherein the first electrode layer and the second electrode layer are arranged on the front surface and the back surface of the circuit board, wherein the first electrode layer and the second electrode layer are located at intersections of the bottom surface and the front surface and the back surface;
• and
• at least one half-hole electrode layer respectively arranged on the bottom surface of the circuit board, and being through the bottom surface, and electrically connected to the first electrode layer and the second electrode layer arranged on the front surface and the back surface of the circuit board respectively,
• wherein the first solder pad and the second solder pad are arranged on the mainboard,
• wherein the first electrode layer, the second electrode layer, and the half-hole electrode layer are electrically fixedly connected to the first solder pad and the second solder pad.