Bipolar electrode, bipolar battery, and method for manufacturing bipolar electrode

A method for manufacturing a bipolar electrode, the method comprising stacking a first active material layer, a first current collector, an intermediate conductor, a second current collector, and a second active material layer in a stacking direction, wherein

• the stacking includes
• forming the first active material layer on a first surface of the first current collector having the first surface and a second surface opposite to each other,
• forming the second active material layer on a second main surface of the second current collector having a first main surface and the second main surface opposite to each other,
• bonding the second surface to a front surface of the intermediate conductor, and
• bonding the first main surface to a back surface of the intermediate conductor,
• in the forming of the second active material layer, the second active material layer is formed such that a length of the second active material layer in a length direction orthogonal to the stacking direction is shorter than that of the first active material layer,
• in the bonding of the first main surface of the second current collector, the second current collector is bonded such that the second active material layer is located inside the first active material layer when viewed from the stacking direction,
• as the intermediate conductor, an intermediate conductor having a length longer than those of the first current collector and the second current collector is used,
• the bonding of the second surface of the first current collector includes applying a first conductive adhesive layer to the second surface, and pressing the first current collector toward the intermediate conductor in a state in which the applied first conductive adhesive layer is in contact with the front surface of the intermediate conductor, and
• the bonding of the first main surface of the second current collector includes applying a second conductive adhesive layer to the first main surface, and pressing the second current collector toward the intermediate conductor in a state in which the applied second conductive adhesive layer is in contact with the back surface of the intermediate conductor.