# US 2026/0100341 A1 · Sheath and Temperature Control of Process Kit > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2026/0100341 A1 - Document ID: US20260100341A1 - Status: Published application - Kind: A1 - Application number: 18/910,783 - Filed: 2024-10-09 - Published: 2026-04-09 - Earliest claimed: 2024-10-09 - Assignees: Applied Materials, Inc. - Applicants: Applied Materials, Inc. - Inventors: Jaeyong CHO; Kartik RAMASWAMY; Daniel Sang BYUN; Tianhong WANG; Kenneth SCHATZ; Kiril KIRKOV; Stephen Donald PROUTY; Reyn Tetsuro WAKABAYASHI; Yoel JW PARK; Jianqiu HUANG; Arkadeep KUMAR; Benjamin Michael STOVER; Carlaton WONG - Web page: https://patentgrep.com/patent/US20260100341A1 ## CPC - H01J 37/32724: {Temperature} - H01J 37/32568: {Relative arrangement or disposition of electrodes; moving means} - H01J 37/32642: {Focus rings} - H01J 37/32715: {Workpiece holder} - H01J 2237/002: Cooling arrangements - H01J 2237/2007: Holding mechanisms - H01J: ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS (spark-gaps H01T; electric arc lamps H05B31/00; particle accelerators H05H) ## Abstract Embodiments of substrate supports are provided herein. In some embodiments, a substrate support includes: a ceramic plate having a first side configured to support a substrate and a second side, wherein the ceramic plate includes an electrode embedded in the ceramic plate; a first cooling plate coupled to the second side of the ceramic plate; a ceramic ring disposed about the ceramic plate and having a first side and a second side, wherein the ceramic ring includes one or more chucking electrodes and a heating element disposed in the ceramic ring, wherein the ceramic ring is spaced apart from the ceramic plate and the first cooling plate; a second cooling plate coupled to the second side of the ceramic ring, wherein the second cooling plate is thermally isolated from the first cooling plate; and a sealing element disposed adjacent to the ceramic ring and the ceramic plate. ## Claims ### Claim 1 A substrate support, comprising: a ceramic plate having a first side configured to support a substrate and a second side opposite the first side, wherein the ceramic plate includes an electrode embedded in the ceramic plate; a first cooling plate coupled to the second side of the ceramic plate; a ceramic ring disposed about the ceramic plate and having a first side and a second side opposite the first side, wherein the ceramic ring includes one or more chucking electrodes and a heating element disposed in the ceramic ring, wherein the ceramic ring is spaced apart from the ceramic plate and the first cooling plate; a second cooling plate coupled to the second side of the ceramic ring, wherein the second cooling plate is thermally isolated from the first cooling plate, wherein the first cooling plate and the second cooling plate include coolant channels configured to circulate a coolant; and a sealing element disposed adjacent to the ceramic ring and the ceramic plate. ### Claim 2 (depends on 1) The substrate support of claim 1, further comprising an edge ring disposed on the ceramic ring and a thermal pad disposed between the edge ring and the ceramic ring. ### Claim 3 (depends on 1) The substrate support of claim 1, further comprising a heater disposed in the ceramic plate. ### Claim 4 (depends on 1) The substrate support of claim 1, wherein the ceramic ring comprises aluminum nitride (AlN) or aluminum oxide (Al2O3). ### Claim 5 (depends on 1) The substrate support of claim 1, wherein the ceramic ring includes a notch at an upper interior edge. ### Claim 6 (depends on 1) The substrate support of claim 1, wherein the ceramic plate includes an annular ring and the sealing element between the ceramic ring and the ceramic plate is disposed between a lower surface of the annular ring and the ceramic ring. ### Claim 7 (depends on 1) The substrate support of claim 1, further comprising a bonding layer disposed between the ceramic ring and the second cooling plate. ### Claim 8 (depends on 7) The substrate support of claim 7, wherein the bonding layer is made from a material having a thermal coefficient of about 0.5 to about 10 w/mK. ### Claim 9 (depends on 1) The substrate support of claim 1, wherein the second cooling plate and the ceramic ring are coupled together via one or more fasteners. ### Claim 10 A substrate support, comprising: a ceramic plate having a first side configured to support a substrate and a second side opposite the first side, wherein the ceramic plate includes an electrode embedded in the ceramic plate; a first cooling plate coupled to the second side of the ceramic plate; a ceramic ring disposed about the ceramic plate and having a first side and a second side opposite the first side, wherein the ceramic ring includes one or more chucking electrodes and a heating element disposed in the ceramic ring, wherein the ceramic ring is spaced apart from the ceramic plate and the first cooling plate; a second cooling plate coupled to the second side of the ceramic ring, wherein the second cooling plate is thermally isolated from the first cooling plate, wherein the first cooling plate and the second cooling plate include coolant channels configured to circulate a coolant; one or more sealing elements disposed adjacent to: the ceramic ring and the second cooling plate; and the ceramic ring and the ceramic plate; and an edge ring disposed on the ceramic ring and a thermal pad disposed between the edge ring and the ceramic ring. ### Claim 11 (depends on 10) The substrate support of claim 10, wherein coolant channels of the first cooling plate are fluidly coupled to coolant channels of the second cooling plate. ### Claim 12 (depends on 10) The substrate support of claim 10, wherein the one or more chucking electrodes of the ceramic ring include a lower electrode, an upper electrode, and one or more posts that couple the lower electrode to the upper electrode. ### Claim 13 (depends on 10) The substrate support of claim 10, wherein the first cooling plate is disposed on the second cooling plate with a thermal isolation layer therebetween. ### Claim 14 (depends on 10) The substrate support of claim 10, wherein the second cooling plate has a raised lip at a peripheral edge of the second cooling plate that extends around the first cooling plate. ### Claim 15 (depends on 10) The substrate support of claim 10, wherein an outer surface of the ceramic ring is coplanar with an outer surface of the second cooling plate. ### Claim 16 A process chamber, comprising: a chamber body having a substrate support disposed within an inner volume of the chamber body, wherein the substrate support includes a ceramic plate having a first side configured to support a substrate and a second side opposite the first side, wherein the ceramic plate includes an electrode embedded in the ceramic plate; a first cooling plate coupled to the second side of the ceramic plate; a ceramic ring disposed about the ceramic plate and having a first side and a second side opposite the first side, wherein the ceramic ring includes one or more chucking electrodes and a heating element disposed in the ceramic ring, wherein the ceramic ring is spaced apart from the ceramic plate and the first cooling plate; a second cooling plate coupled to the second side of the ceramic ring, wherein the second cooling plate is thermally isolated from the first cooling plate, wherein the first cooling plate and the second cooling plate include coolant channels configured to circulate a coolant; and a sealing element disposed adjacent to the ceramic ring and the ceramic plate. ### Claim 17 (depends on 16) The process chamber of claim 16, further comprising an edge ring disposed on the ceramic ring and a thermal pad disposed between the edge ring and the ceramic ring. ### Claim 18 (depends on 16) The process chamber of claim 16, wherein the first cooling plate and the second cooling plate are disposed on an insulator. ### Claim 19 (depends on 18) The process chamber of claim 18, further comprising an o-ring disposed between the ceramic ring and the second cooling plate, and a second o-ring disposed between the insulator and the second cooling plate. ### Claim 20 (depends on 16) The process chamber of claim 16, wherein the first cooling plate is disposed on the second cooling plate with a thermal isolation layer therebetween.