High temperature electrical conductor insulation for electromechanical devices
AssigneeHoneywell International Inc.
InventorsEric Passman, Mahdi Mohajeri
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Abstract
A method of forming a bonded coil is disclosed. A flat and/or rectangular wire conductor is formed into a spring. The spring is coated with ingredients using a first heat treatment to remove any organic material from the ingredients that cannot withstand temperatures above a first temperature. The spring is compressed into an edge-wound coil. A second heat treatment is performed at a second temperature to bond the edge-wound coil together and form the bonded coil. The bonded coil can operate in a temperature range up to a melting point of the insulation without degradation.
Claims20
A method of forming a bonded coil, comprising:
- forming a flat wire conductor into a spring;
- coating the spring with ingredients and applying a first heat treatment to remove any organic material from the ingredients that cannot withstand temperatures above a first temperature and form insulation around the spring;
- compressing the spring into an edge-wound coil;
- performing a second heat treatment at a second temperature to bond the edge-wound coil together and form the bonded coil, wherein the bonded coil can operate in a temperature range up to a melting point of the insulation without degradation.
A bonded coil, comprising:
- a flat wire conductor formed into a spring;
- ingredients that coat the spring, wherein a first heat treatment removes any organic material from the ingredients that cannot withstand temperatures above a first temperature and form insulation around the spring;
- wherein the spring is compressed into an edge-wound coil;
- wherein a second heat treatment at a second temperature bonds the edge-wound coil together and form the bonded coil;
- wherein the bonded coil can operate in a temperature range up to a melting point of the insulation without degradation.
Dependencies are inferred from the claim text.