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US 2026/0098149 A1Published application
Resin composition for molding and electronic component device
AssigneeResonac Corporation
InventorsMika TANAKA, Yuma TAKEUCHI, Yuta SUKEGAWA, Shintaro OKADA
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Abstract
A resin composition for molding includes an epoxy resin, a curing agent containing an active ester compound, an inorganic filler, and a porous polymer particle.
Claims11
A resin composition for molding comprising:
- an epoxy resin, a curing agent containing an active ester compound, an inorganic filler, and a porous polymer particle.
Dependencies are inferred from the claim text.