Resin composition, film with resin, prepreg, sheet of metal foil with resin, metal-clad laminate, and printed wiring board
AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorsAkihiro YAMAUCHI, Yasunari TOMITA, Nobuo SHIBATA, Eiichiro SAITO
Life of this patent
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Abstract
A resin composition contains: an epoxy resin (A); an inorganic filler (B) having a thermal conductivity equal to or greater than 10 W/m·K; and at least one selected from the group consisting of a heavy metal deactivator (C) and an ion scavenger (D). The inorganic filler (B) has a volume-based cumulative 99% particle size equal to or less than 50 μm as measured by a laser diffraction particle size distribution analysis method. The content of the inorganic filler (B) is equal to or greater than 84% by mass and equal to or less than 97% by mass with respect to the resin composition.
Claims17
A resin composition containing:
- an epoxy resin (A);
- an inorganic filler (B) having a thermal conductivity equal to or greater than 10 W/m·K;
- and
- at least one selected from the group consisting of a heavy metal deactivator (C) and an ion scavenger (D),
- the inorganic filler (B) having a volume-based cumulative 99% particle size equal to or less than 50 μm as measured by a laser diffraction particle size distribution analysis method, and
- content of the inorganic filler (B) being equal to or greater than 84% by mass and equal to or less than 97% by mass with respect to the resin composition.
Dependencies are inferred from the claim text.