Chuck table and method for grinding wafer
AssigneeDisco Corporation
InventorDaishi KONNO
Life of this patent
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Abstract
A chuck table holds a wafer having an off-cut angle by suction for grinding with a grindstone. The chuck table includes a disk-shaped porous member and a path-length varying portion. The path-length varying portion creates a path-length difference in paths of the grindstone grinding the porous member such that a holder surface, formed by rotating the porous member about a rotation axis extending through a center of the porous member and grinding an upper surface of the porous member with the grindstone, has a height difference between one side and the other side across a line that extends through the center of the porous member.
Claims4
A chuck table configured to hold a wafer having an off-cut angle by suction for grinding with a grindstone, comprising:
- a disk-shaped porous member;
- and
- a path-length varying portion configured to create a path-length difference in paths of the grindstone grinding the porous member such that a holder surface, formed by rotating the porous member about a rotation axis extending through a center of the porous member and grinding an upper surface of the porous member with the grindstone, has a height difference between one side and the other side across a line that extends through the center of the porous member.
Dependencies are inferred from the claim text.