US 2026/0096480 A1 · STACKED SEMICONDUCTOR APPARATUS, METHOD OF DETECTING FAULT, AND METHOD OF REPAIRING FAULT

Abstract

A stacked semiconductor apparatus, which is formed by stacking a first die and a second die, includes the first die including a first test module configured to generate a test pattern and a plurality of transmission multiplexers, each of which one input receives the test pattern, the second die including a plurality of reception multiplexers and a second test module configured to control the plurality of reception multiplexers, and a connection part including a plurality of signal transmission members electrically connected to outputs of the plurality of transmission multiplexers and each connected to one input of the reception multiplexers, and a robust transmission member configured to transmit a signal between the first test module and the second test module, wherein the second test module transmits a signal, which is received by the reception multiplexer through the signal transmission member, to the first test module through the robust transmission member, and the first test module detects a fault of the signal transmission member by comparing the test pattern with the signal transmitted by the second test module through the robust transmission member.

Claims20

Dependent claims

A stacked semiconductor apparatus formed by stacking a first die (10) and a second die (20), the stacked semiconductor apparatus comprising:

the first die including a first test module configured to generate a test pattern and a plurality of transmission multiplexers, each of which one input receives the test pattern;
the second die including a plurality of reception multiplexers and a second test module configured to control the plurality of reception multiplexers;
and
a connection part including a plurality of signal transmission members electrically connected to outputs of the plurality of transmission multiplexers and each connected to one input of the reception multiplexers, and a robust transmission member configured to transmit a signal between the first test module and the second test module,
wherein the second test module transmits a signal, which is received by the reception multiplexer through the signal transmission member, to the first test module through the robust transmission member, and
the first test module detects a fault of the signal transmission member by comparing the test pattern with the signal transmitted by the second test module through the robust transmission member.

3 more elements

A method of repairing a stacking fault of a first die and a second die, the method comprising:

detecting, by a first test module, a fault of a plurality of signal transmission members configured to electrically connect the first die and the second die;
controlling, by the first test module, a bypass multiplexer to output an output of a multiplexer connected to a signal transmission member having the detected fault through a bypass transmission member;
and
controlling, by a second test module, a reception multiplexer connected to the signal transmission member having the fault to output a signal provided through the bypass transmission member.

1 more element

Dependencies are inferred from the claim text.

Stacked semiconductor apparatus, method of detecting fault, and method of repairing fault

Life of this patent

Stacked semiconductor apparatus, method of detecting fault, and method of repairing fault

Life of this patent

Abstract

Claims20