US 2026/0096438 A1 · SEMICONDUCTOR PACKAGE WITH A CIRCUIT COMPONENT EMBEDDED IN A PACKAGING SUBSTRATE

Abstract

A semiconductor device includes a die and a coreless embedded trace substrate (ETS). The die has an embedded circuit. The die can include ports on a surface of the die coupled to the embedded circuit of the die. The coreless ETS can underlie the die. The ETS can include a cavity having circuit components embedded in the cavity, ports on a surface of the ETS coupled to the circuit components embedded in the cavity and solder balls coupling the ports of the ETS to the ports of the die. In some examples, the embedded circuit in the die is a switching power field effect transistor (FET), in other examples, a bulk acoustic wave (BAW) resonator. The circuits embedded in the cavity, in some instances, include a radio frequency (RF) network for the BAW resonator, in other examples, include passive circuit components.

Claims20

Dependent claims

A semiconductor package comprising:

a die comprising:
an embedded bulk acoustic wave (BAW) resonator;
and
ports on a surface of the die coupled to the BAW resonator;
an embedded trace substrate (ETS) underlying the die, the ETS comprising:
embedded components for a radio frequency (RF) network;
and
ports on a surface of the ETS coupled to the RF network;
and
solder balls coupling the ports of the die to the ports of the ETS.

7 more elements

Dependencies are inferred from the claim text.

Semiconductor package with a circuit component embedded in a packaging substrate

Life of this patent

Semiconductor package with a circuit component embedded in a packaging substrate

Life of this patent

Abstract

Claims20