Technologies for a photon pair source on an integrated photonic die

A photonic integrated circuit (PIC) die comprising:

• a first silicon waveguide forming a first resonator, the first silicon waveguide coupled to an amplifier region, wherein the first resonator is resonant at a first frequency;
• a second silicon waveguide forming a second resonator, wherein the second resonator is resonant at the first frequency and at a second frequency, wherein the second frequency is a Raman shift away from the first frequency;
• and
• one or more waveguides to couple light between the first resonator and the second resonator.

A photonic integrated circuit (PIC) die comprising:

• means for generating first laser light, wherein the means for generating the first laser light has a gain bandwidth more than one terahertz;
• means for generating second laser light, wherein the means for generating the second laser light has a gain bandwidth less than 200 gigahertz, wherein the first laser light is to pump the means for generating the second laser light;
• and
• means for generating entangled photon pairs, wherein the means for generating entangled photon pairs is to pump the means for generating entangled photon pairs.