Sputtering apparatus, apparatus for manufacturing magnetic recording medium, thin film forming method, and method for manufacturing magnetic recording medium

Abstract

A sputtering apparatus forms a thin film by depositing sputtered particles of a target on a substrate, using a magnetic field generated from a back surface side of the target toward the substrate provided to face a front surface of the target. The sputtering apparatus has a magnetic field generator provided on the back surface of the target, a rotor configured to rotate the magnetic field generator, and a cylindrical sputter adjustment member provided between the target and the substrate on a center axis connecting a center of the target and a center position of the substrate. The sputter adjustment member is made of a metal, and includes a hole located at a position including the center axis.

Dependencies are inferred from the claim text.