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US 2026/0094751 A1Published application
Demountable solder joints for coupling superconducting current paths
AssigneeMassachusetts Institute of Technology
InventorsBrian LABOMBARD, William BECK, Theodore MOURATIDIS
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Abstract
Described are concepts directed toward systems, structures and techniques to create low-resistance, high current capacity, demountable solder joint connections. Such systems, structures and techniques may be used to simultaneously create low-resistance, high current capacity, demountable solder joint connections at multiple locations between no insulation (NI) superconductors and in particular between NI high temperature superconductors (HTS) such as may be used in NI-HTS magnets.
Claims19
An apparatus comprising:
- a first plate comprising a plurality of channels that include a first layer of a high temperature superconductor (HTS) and a first electrically conductive layer over the first layer of the HTS;
- a second plate comprising a plurality of channels that include a second layer of HTS and a second electrically conductive layer over the second layer of HTS;
- and
- a layer of solder contacting a portion of the first electrically conductive layer of the first plate and a portion of the second electrically conductive layer of the second plate, wherein the second plate is disposed over the first plate such that the portion of the first electrically conductive layer is arranged to overlap the portion of the second electrically conductive layer with the layer of solder between the portion of the first electrically conductive layer and the portion of the second electrically conductive layer, thereby providing an electrically conductive path from the first electrically conductive layer to the second electrically conductive layer.
1 more element
An apparatus comprising:
- a first plate having a plurality of channels provided therein;
- a high temperature superconductor (HTS) material disposed in the plurality of channels of the first plate;
- a first electrically conductive layer disposed over the HTS material;
- a second plate having a plurality of channels provided therein;
- an HTS material disposed in the plurality of channels of the second plate;
- a second electrically conductive layer disposed over the HTS material;
- and
- a conductor contacting a portion of the first electrically conductive layer of the first plate and a portion of the second electrically conductive layer of the second plate,
- wherein the second plate is disposed over the first plate such that the portion of the first electrically conductive layer is arranged to overlap the portion of the second electrically conductive layer with the conductor between the portion of the first electrically conductive layer and the portion of the second electrically conductive layer, thereby providing an electrically conductive path from the first electrically conductive layer to the second electrically conductive layer.
6 more elements
Dependencies are inferred from the claim text.