Memory module, electronic device, and data migration method
AssigneeHuawei Technologies Co., Ltd.
InventorsYunbing Bao, Hubao Lei, Yuanjun Niu
Life of this patent
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Abstract
A low-cost memory expansion solution of a server system utilizes cold and hot migration using a processing module in a memory module and a component outside the module to reduce working pressure of the processing module. A power pin of a gold finger connector in the memory module is redefined as a pin whose width is greater than that of an original power pin so that a through-current capability of the power pin can be improved, supply power of the power pin can be increased, and increased supply power can support arrangement of more storage media in the memory module, to further expand a memory of the server system.
Claims20
A memory module, comprising:
- a processing module;
- and
- a gold finger connector connected to the processing module, wherein:
- the gold finger connector is configured to be plugged to a component outside the memory module to implement a communication connection between a component in the memory module and the component outside the memory module;
- and
- the processing module is configured to:
- receive a read/write request from the component outside the memory module through the gold finger connector;
- access at least one storage medium in the memory module based on the read/write request;
- and
- transmit, to the component outside the memory module through the gold finger connector, access frequency information of each storage address corresponding to at least one storage medium in the memory module within a preset time period.
An electronic device, comprising:
- a memory module;
- a processing module;
- and
- a gold finger connector connected to the processing module, wherein:
- the gold finger connector is configured to be plugged to a component outside the memory module, to implement a communication connection between a component in the memory module and the component outside the memory module;
- and
- the processing module is configured to:
- receive a read/write request from the component outside the memory module through the gold finger connector;
- access at least one storage medium in the memory module based on the read/write request;
- and
- transmit, to the component outside the memory module through the gold finger connector, access frequency information of each storage address corresponding to at least one storage medium in the memory module within a preset time period.
Dependencies are inferred from the claim text.