# US 2026/0093301 A1 · Stacking of heat-generating devices and heat-rejecting media > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2026/0093301 A1 - Document ID: US20260093301A1 - Status: Published application - Kind: A1 - Application number: 18/901,574 - Filed: 2024-09-30 - Published: 2026-04-02 - Earliest claimed: 2024-09-30 - Assignees: Dell Products L.P. - Applicants: Dell Products L.P. - Inventors: Qinghong HE; Ihab SAAD; Jay M. ZILL - Web page: https://patentgrep.com/patent/US20260093301A1 ## CPC - G06F 1/203: {for portable computers, e.g. for laptops} - G06F 1/206: {comprising thermal management} - G06F 1/1658: {related to the mounting of internal components, e.g. disc drive or any other functional module} - H05K 7/20154: {Heat dissipaters coupled to components} - G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract A system may include a first electronic device mechanically and electrically mounted on a first circuit board, a second electronic device mechanically and electrically mounted on a second circuit board, heat-rejecting media, first mechanical mounting features formed on the heat-rejecting media and on the first circuit board mechanically spring coupling the heat-rejecting media to the first circuit board in order to thermally couple the first electronic device to a first surface on a first side of the heat-rejecting media, and second mechanical mounting features formed on the second circuit board and on one of either of the first circuit board and the heat-rejecting media and mechanically spring coupling the second circuit board to one of either the heat-rejecting media and the first circuit board in order to thermally couple the second electronic device to a second surface on a second side of the heat-rejecting media opposite the first side. ## Claims ### Claim 1 A system comprising: a first electronic device mechanically and electrically mounted on a first circuit board; a second electronic device mechanically and electrically mounted on a second circuit board; heat-rejecting media; first mechanical mounting features formed on the heat-rejecting media and on the first circuit board mechanically spring coupling the heat-rejecting media to the first circuit board in order to thermally couple the first electronic device to a first surface on a first side of the heat-rejecting media; and second mechanical mounting features formed on the second circuit board and on one of either of the first circuit board and the heat-rejecting media and mechanically spring coupling the second circuit board to one of either the heat-rejecting media and the first circuit board in order to thermally couple the second electronic device to a second surface on a second side of the heat-rejecting media opposite the first side. ### Claim 2 (depends on 1) The system of claim 1, wherein the first electronic device comprises a processor and the first circuit board comprises a motherboard. ### Claim 3 (depends on 1) The system of claim 1, wherein the second electronic device comprises a graphics processing unit. ### Claim 4 (depends on 1) The system of claim 1, wherein the first mechanical mounting features comprise: a leaf spring mechanically coupled to the heat-rejecting media, with a plurality of openings formed within the leaf spring; a plurality of mounting standoffs formed on the first circuit board; and a plurality of fasteners, each fastener of the plurality of fasteners passing through a respective opening of the plurality of openings and mechanically engaging with a respective mounting standoff of the plurality of mounting standoffs. ### Claim 5 (depends on 1) The system of claim 1, wherein the second mechanical mounting features comprise: a plurality of openings formed within the second circuit board; a plurality of mounting standoffs formed on the heat-rejecting media; and a plurality of spring fasteners, each spring fastener of the plurality of spring fasteners passing through a respective opening of the plurality of openings and mechanically engaging with a respective mounting standoff of the plurality of mounting standoffs. ### Claim 6 (depends on 1) The system of claim 1, wherein the second mechanical mounting features comprise: a plurality of openings formed within the second circuit board; a plurality of mounting standoffs formed on the first circuit board; and a plurality of spring fasteners, each spring fastener of the plurality of spring fasteners passing through a respective opening of the plurality of openings and mechanically engaging with a respective mounting standoff of the plurality of mounting standoffs. ### Claim 7 (depends on 1) The system of claim 1, wherein the heat-rejecting media comprises at least one of a heat pipe, a heat spreader, a heatsink, a vapor chamber, or a fin stack. ### Claim 8 A method comprising: mechanically spring coupling, with first mechanical mounting features formed on heat-rejecting media and on a first circuit board, the heat-rejecting media to the first circuit board in order to thermally couple a first electronic device mechanically and electrically mounted on the first circuit board to a first surface on a first side of the heat-rejecting media; and mechanically spring coupling, with second mechanical mounting features formed on a second circuit board and on one of either of the first circuit board and the heat-rejecting media, the second circuit board to one of either the heat-rejecting media and the first circuit board in order to thermally couple a second electronic device mechanically and electrically mounted on the second circuit board to a second surface on a second side of the heat-rejecting media opposite the first side. ### Claim 9 (depends on 8) The method of claim 8, wherein the first electronic device comprises a processor and the first circuit board comprises a motherboard. ### Claim 10 (depends on 8) The method of claim 8, wherein the second electronic device comprises a graphics processing unit. ### Claim 11 (depends on 8) The method of claim 8, wherein the first mechanical mounting features comprise: a leaf spring mechanically coupled to the heat-rejecting media, with a plurality of openings formed within the leaf spring; a plurality of mounting standoffs formed on the first circuit board; and a plurality of fasteners, each fastener of the plurality of fasteners passing through a respective opening of the plurality of openings and mechanically engaging with a respective mounting standoff of the plurality of mounting standoffs. ### Claim 12 (depends on 8) The method of claim 8, wherein the second mechanical mounting features comprise: a plurality of openings formed within the second circuit board; a plurality of mounting standoffs formed on the heat-rejecting media; and a plurality of spring fasteners, each spring fastener of the plurality of spring fasteners passing through a respective opening of the plurality of openings and mechanically engaging with a respective mounting standoff of the plurality of mounting standoffs. ### Claim 13 (depends on 8) The method of claim 8, wherein the second mechanical mounting features comprise: a plurality of openings formed within the second circuit board; a plurality of mounting standoffs formed on the first circuit board; and a plurality of spring fasteners, each spring fastener of the plurality of spring fasteners passing through a respective opening of the plurality of openings and mechanically engaging with a respective mounting standoff of the plurality of mounting standoffs. ### Claim 14 (depends on 8) The method of claim 8, wherein the heat-rejecting media comprises at least one of a heat pipe, a heat spreader, a heatsink, a vapor chamber, a fin stack.