Sensor Module
AssigneeSeiko Epson Corporation
InventorsTaketo CHINO, Yoshikuni SAITO, Masayasu SAKUMA
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Abstract
A sensor module includes a sensor substrate including a circuit substrate and an inertial sensor mounted on the circuit substrate, a package including a first surface and a second surface in a front-back relationship and a side surface coupling the first surface and the second surface, and housing the sensor substrate inside, and a flexible wiring portion electrically coupled to the sensor substrate and extending from the side surface to an outside of the package, wherein the package includes a convex portion protruding from the first surface and engaging with an object.
Claims6
A sensor module comprising:
- a sensor substrate including a circuit substrate and an inertial sensor mounted on the circuit substrate;
- a package including a first surface and a second surface in a front-back relationship and a side surface coupling the first surface and the second surface, and housing the sensor substrate inside;
- and
- a flexible wiring portion electrically coupled to the sensor substrate and extending from the side surface to an outside of the package, wherein
- the package includes a convex portion protruding from the first surface and engaging with an object.
Dependencies are inferred from the claim text.