Ultrasound probe

Abstract

Provided is an ultrasound probe that can reduced in size while suppressing an increase in temperature due to heat generated from an integrated circuit. An ultrasound probe includes a heat transfer member that is sheet-like and that is disposed between an inner surface of a housing and an integrated circuit so as to cover at least a periphery of the integrated circuit, and a heat transfer control member that is sheet-like, that is disposed between the heat transfer member and the integrated circuit so as to cover at least the periphery of the integrated circuit, and that controls heat conduction between the integrated circuit and the heat transfer member, in which the heat transfer control member is in contact with the heat transfer member, and a contact area per unit area, directly above the integrated circuit, between the heat transfer control member and the heat transfer member is smaller than a contact area per unit area, in the periphery of the integrated circuit, between the heat transfer control member and the heat transfer member.

Dependencies are inferred from the claim text.