Low temperature hermetic sealing via laser
AssigneeGuardian Glass, LLC
InventorsVijayen S. VEERASAMY, Martin D. Bracamonte
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Abstract
A method and apparatus for low temperature laser sealing of bonded articles is disclosed. Hermetic sealing of glass substrates using low temperature sealing techniques that do not adversely affect bulk strength of glass substrates, the environment created between the substrates and/or any components housed within the sealed glass substrates is disclosed. Such low temperature sealing techniques include use of localized laser heating of sealing materials to form a hermetic seal between glass substrates that does not involve heating the entire article to be sealed.
Claims21
1-39. (canceled)
A method of making a vacuum insulated glass (VIG) window unit, the method comprising:
- applying a seal material to an area of a first substrate, wherein the seal material comprises a layer comprising a metallic or substantially metallic solder and a first absorber film, wherein the first absorber film is disposed between the layer and the first substrate;
- forming a seal between the first substrate and a second substrate by at least:
- at least partially melting at least part of the seal material using laser irradiation, the laser irradiation being directed toward the seal material but not being directed toward a majority of the first substrate;
- bonding the first substrate to the second substrate by continuing to irradiate the seal material with laser irradiation;
- and
- evacuating a cavity formed between the first and second substrates and defined by the seal to a pressure lower than atmospheric pressure, in making the VIG window unit.
A method of making an article including a sealed cavity formed between substrates, the method comprising:
- applying a sealing material to at least one of a first or second substrate, the first and second substrates comprising glass;
- and
- forming a seal between the first and second substrates by irradiating the sealing material with a laser, wherein said cavity is defined by the first and second substrates and the seal,
- wherein the sealing material comprises a layer comprising a metallic or substantially metallic solder and a first absorber film, wherein the first absorber film is disposed between the layer and the first substrate.
Dependencies are inferred from the claim text.