# US 2026/0090433 A1 · 3d printing of glass core edge protection in ic device packaging > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2026/0090433 A1 - Document ID: US20260090433A1 - Status: Published application - Kind: A1 - Application number: 18/898,414 - Filed: 2024-09-26 - Published: 2026-03-26 - Earliest claimed: 2024-09-26 - Assignees: Intel Corporation - Applicants: Intel Corporation - Inventors: Zhixin Xie; Mohamed Saber; Bohan Shan; Anastasia Arrington; Clay Arrington; Jigneshkumar Patel; Catherine Mau; Ryan Carrazzone; Haobo Chen; Wei Li; Kyle Arrington; Ziyin Lin; Dingying Xu; Hongxia Feng; Hiroki Tanaka; Brandon Marin; Jeremy Ecton; Benjamin Duong; Gang Duan; Srinivas Pietambaram; Praveen Sreeramagiri; Andrew Jimenez; Yekan Wang; Jung Kyu Han - Web page: https://patentgrep.com/patent/US20260090433A1 ## CPC - H10W 70/69: Insulating materials thereof - H10W 70/695: Organic materials - H10W 90/401: {characterised by multiple insulating or insulated package substrates, interposers or RDLs} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract 3D printing material in direct contact with edge of a glass core in IC packages to additively form a frame. Multiple such cores may be reconstituted into a panel that may then be built-up with routing metallization and assembled with IC die. Layers of printed material may be built up to form a frame with approximately the same thickness as the glass core and of any desired lateral width. The printed material may be an organic polymer or inorganic composition including metallics and ceramics. Beads of different material composition may be printed in succession to vary mechanical, electrical and/or thermal properties. A portion of the protective frame may be retained on an edge of the glass core when panels are singulated into package substrate units. Frame material may also be printed upon edges of glass-cored package units after their singulation. ## Claims ### Claim 1 An apparatus, comprising an integrated circuit (IC) die package substrate, comprising: a glass core having an edge of a thickness between a first side and a second side of the glass core; via metallization features extending through the thickness of the glass core; an organic dielectric material over at least one of the first or second sides of the glass core; and one or more layers of organic, inorganic, or composite material in direct contact with an edge of the glass core, wherein an exterior surface of each of the one or more layers has convex curvature. ### Claim 2 (depends on 1) The apparatus of claim 1, wherein the convex curvature has a radius of curvature that is no greater than the thickness of the glass core. ### Claim 3 (depends on 2) The apparatus of claim 2, wherein the exterior surface with the convex curvature is opposite the edge of the glass core. ### Claim 4 (depends on 2) The apparatus of claim 2, wherein the radius of curvature is no greater than one-half the thickness of the glass core. ### Claim 5 (depends on 1) The apparatus of claim 1, wherein the one or more layers comprise a plurality of the layers of organic or inorganic material in a vertical stack from the first side of the glass core to the second side of the core, and wherein each of the layers in the stack adjacent to a portion of the thickness of the edge. ### Claim 6 (depends on 5) The apparatus of claim 5, wherein a portion of each of the layers has an exterior surface with convex curvature opposite the edge of the glass core. ### Claim 7 (depends on 1) The apparatus of claim 1, wherein the one or more layers comprise a plurality of the layers of organic or inorganic material in a horizontal stack extending outward from the edge of the glass core, and wherein a first of the layers between the edge of the glass core and a second of the layers. ### Claim 8 (depends on 1) The apparatus of claim 1, wherein a first of the layers has a first material composition and a second of the layers has a second material composition. ### Claim 9 (depends on 8) The apparatus of claim 8, wherein at least elastic modulus differs between the first material composition and the second material composition. ### Claim 10 (depends on 1) The apparatus of claim 1, wherein at least one of the one or more layers of organic or inorganic material comprises an organic polymer or a metallic material. ### Claim 11 (depends on 10) The apparatus of claim 10, wherein at least one of the layers comprises an organic polymer. ### Claim 12 (depends on 11) The apparatus of claim 11, wherein at least one of the layers has a composition of at least ten atomic percent carbon or at least ten atomic percent fluorine. ### Claim 13 (depends on 10) The apparatus of claim 10, wherein at least one of the one or more layers of organic or inorganic material comprises an epoxy resin. ### Claim 14 An integrated circuit (IC) packaging panel, comprising: a first glass core unit having a first rectangular perimeter edge of a thickness between front and back sides of the IC packaging panel; a second glass core unit having a second rectangular perimeter edge of the thickness front and back sides of the IC packaging panel, wherein a first length of the first perimeter edge is adjacent to a second length of the second perimeter edge; and one or more beads of organic or inorganic material in direct contact with at least a portion of the first rectangular perimeter edge or the second rectangular perimeter edge. ### Claim 15 (depends on 14) The IC packaging panel of claim 14, wherein an exterior surface of each of the one or more beads has convex curvature. ### Claim 16 (depends on 14) The IC packaging panel of claim 14, wherein at least one of the beads is between the first length of the first perimeter edge and the second length of the second perimeter edge. ### Claim 17 (depends on 14) The IC packaging panel of claim 14, wherein the beads comprise a plurality of beads of organic or inorganic material in a vertical stack from the back side of the panel to the front side of the panel with each of the beads in the stack in direct contact with a portion of the thickness of the edge along the portion of the first rectangular perimeter edge or the second rectangular perimeter edge. ### Claim 18 (depends on 17) The IC packaging panel of claim 17, wherein the vertical stack has a thickness substantially equal to the thickness of the edge, and wherein each of the beads has a thickness of 0.5 μm to 100 μm. ### Claim 19 (depends on 14) The IC packaging panel of claim 14, wherein at least one of the beads comprises an epoxy resin. ### Claim 20 (depends on 14) The IC packaging panel of claim 14, wherein the one or more beads define a frame encircling the IC packaging panel, and wherein the one or more beads define both a thickness of frame and lateral width of the frame.