US 2026/0090416 A1 · DISAGGREGATED SEMICONDUCTOR CHIP ON INTERPOSER WITHOUT THROUGH-SUBSTRATE VIAS

Abstract

Devices and systems with interposers that do not include through-substrate vias, and methods of forming the same, are disclosed herein. In one example, a microelectronic assembly includes an interposer and one or more integrated circuit (IC) dies coupled to the interposer. The interposer includes one or more conductive traces and one or more vias, but the interposer does not include through-substrate vias. The respective IC dies are electrically coupled to the interposer via dielectric-to-dielectric and metal-to-metal bonds at the interface between the interposer and the respective IC dies.

Claims20

Dependent claims

A microelectronic assembly, comprising:

an interposer, wherein the interposer comprises one or more conductive traces and one or more vias, wherein the interposer does not comprise through-substrate vias;
and
one or more integrated circuit (IC) dies coupled to the interposer, wherein the respective IC dies are electrically coupled to the interposer via dielectric-to-dielectric and metal-to-metal bonds at an interface between the interposer and the respective IC dies.

Dependencies are inferred from the claim text.

Disaggregated semiconductor chip on interposer without through-substrate vias

Life of this patent

Disaggregated semiconductor chip on interposer without through-substrate vias

Life of this patent

Abstract

Claims20