Cover for module tray and module tray for semiconductor device including the same
AssigneeSamsung Electronics Co., Ltd.
InventorTaegeon KIM
Life of this patent
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AssigneeSamsung Electronics Co., Ltd.
InventorTaegeon KIM
Estimating the term…
A cover for a module tray includes a cover structure to cover a case of a semiconductor device, and a card accommodation portion on an upper surface of the cover structure to accommodate a card. The card accommodation portion includes a first bracket having a first accommodation guide extending in the first horizontal direction, a second bracket spaced apart from the first bracket and having second and third accommodation guides, the second accommodation guide extending in the first horizontal direction to face the first accommodation guide, and the third accommodation guide extending in the second horizontal direction, and a third bracket spaced apart from the first and second brackets, and having fourth and fifth accommodation guides, the fourth accommodation guide extending in the first horizontal direction to face the first accommodation guide, and the fifth accommodation guide extending in the second horizontal direction to face the third accommodation guide.
A cover for a module tray, the cover comprising:
A cover for a module tray, the cover comprising:
A module tray for a semiconductor device, the module tray comprising:
Dependencies are inferred from the claim text.