# US 2026/0090318 A1 · Micro device mass transfer equipment > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2026/0090318 A1 - Document ID: US20260090318A1 - Status: Published application - Kind: A1 - Application number: 19/403,988 - Filed: 2025-11-30 - Published: 2026-03-26 - Earliest claimed: 2021-08-02 - Assignees: PlayNitride Display Co., Ltd. - Applicants: PlayNitride Display Co., Ltd. - Inventors: Yun-Li Li; Yu-Hung Lai - Web page: https://patentgrep.com/patent/US20260090318A1 ## CPC - H10P 72/0446: {Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates} - H10P 72/0428: {Apparatus for mechanical treatment or grinding or cutting} - H10P 72/0432: {mainly by conduction} - H10P 72/0442: {Apparatus for placing on an insulating substrate, e.g. tape} - H10H 20/01: Manufacture or treatment - H10H 20/018: {Bonding of wafers} - H10P 72/74: {using temporarily an auxiliary support} - H10P 72/7428: {used to support diced chips prior to mounting} - H10P 72/744: {Details of chemical or physical process used for separating the auxiliary support from a device or a wafer} - H10W 90/00: Package configurations - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A micro device mass transfer equipment including a base stage, a moving stage, a substrate stage, a laser device, a rolling and pressing mechanism, and a heating mechanism is provided. The moving stage is movably disposed on the base stage, and moves with a moving path. The substrate stage is movably disposed on the base stage, and is adapted to move between different positions overlapping the moving stage. The laser device is movably disposed on the base stage. The laser device is adapted to move relative to the substrate stage, and emits a laser beam toward the substrate stage. The rolling and pressing mechanism is disposed on the moving path of the moving stage, and forms a contact region with the moving stage. The heating mechanism is disposed corresponding to the contact region, and is adapted to heat the contact region between the moving stage and the rolling and pressing mechanism. ## Claims ### Claim 1 A micro device mass transfer equipment, comprising: a base stage; a moving stage, movably disposed on the base stage and moving with a moving path; a substrate stage, movably disposed on the base stage and adapted to move between different positions overlapping the moving stage; a laser device, positioned with respect to the substrate stage, wherein the laser device is adapted to move relative to the substrate stage and emits a laser beam toward the substrate stage; a rolling and pressing mechanism, disposed on the moving path of the moving stage and forming a contact region with the moving stage; and a servo motor module, configured to drive the moving stage, the substrate stage and the laser device to move along their respective movement axes. ### Claim 2 (depends on 1) The micro device mass transfer equipment according to claim 1, wherein a gantry type moving mechanism of the base stage is formed by at least four support columns and at least two beams, and the substrate stage and the laser device are movably mounted on the gantry type moving mechanism of the base stage. ### Claim 3 (depends on 2) The micro device mass transfer equipment according to claim 2, wherein the servo motor module includes a first servo motor and a second servo motor disposed between the moving stage and the base stage, a plurality of third servo motors disposed between the at least four support columns and the at least two beams, a plurality of fourth servo motors disposed between the at least two beams and the substrate stage, a plurality of fifth servo motors disposed between the at least two beams and a gantry mechanism, and a sixth servo motor disposed between the gantry mechanism and a supporting arm. ### Claim 4 (depends on 3) The micro device mass transfer equipment according to claim 3, wherein the laser device is mounted on the gantry mechanism via the supporting arm. ### Claim 5 (depends on 1) The micro device mass transfer equipment according to claim 1, further comprising: a heating mechanism, disposed corresponding to the contact region and configured to heat the contact region. ### Claim 6 (depends on 5) The micro device mass transfer equipment according to claim 5, wherein the heating mechanism comprises: a laser light source, disposed in the base stage and located on a side of the moving stage facing away from the rolling and pressing mechanism, and adapted to irradiate the contact region with another laser beam to heat the contact region. ### Claim 7 (depends on 5) The micro device mass transfer equipment according to claim 5, wherein the rolling and pressing mechanism comprises a roller, and the heating mechanism is disposed on a circumferential surface of the roller. ### Claim 8 (depends on 5) The micro device mass transfer equipment according to claim 5, wherein the substrate stage does not overlap the contact region. ### Claim 9 (depends on 1) The micro device mass transfer equipment according to claim 1, wherein the laser device irradiates through at least one opening of the substrate stage. ### Claim 10 A micro device mass transfer equipment, comprising: a plurality of transfer stations, each comprising: a first base stage; a substrate stage, movably disposed on the first base stage and adapted to move close to or away from the first base stage along a movement axis; and a laser device, movably disposed on the first base stage, wherein the laser device is adapted to move relative to the substrate stage and emits a laser beam toward the substrate stage; a plurality of thermal bonding stations, each comprising: a second base stage; and a rolling and pressing mechanism, disposed on the second base stage; a plurality of moving stages, respectively adapted to carry a plurality of target substrates, wherein each of the plurality of moving stages is adapted to move to a predetermined position on one of the first base stages of the plurality of transfer stations and the second base stages of the plurality of thermal bonding stations along a moving path, such that the substrate stage or the rolling and pressing mechanism overlaps the each of the plurality of moving stages along an axial direction of the movement axis, the substrate stage is adapted to move between different positions overlapping one of the plurality of moving stages, and the rolling and pressing mechanism forms a contact region with another one of the plurality of moving stages; a servomotor module, configured to drive the plurality of moving stages, the substrate stages of the plurality of transfer stations and the laser devices of the plurality of transfer stations to move along their respective movement axes. ### Claim 11 (depends on 10) The micro device mass transfer equipment according to claim 10, further comprising: a heating mechanism, disposed in the second base stage and adapted to heat the contact region. ### Claim 12 (depends on 10) The micro device mass transfer equipment according to claim 10, further comprising: A transposition mechanism, adapted to transfer each of the plurality of target substrates between the first base stage of one of the plurality of transfer stations and the second base stage of one of the plurality of thermal bonding stations. ### Claim 13 (depends on 12) The micro device mass transfer equipment according to claim 12, wherein the transposition mechanism comprises a rotation mechanism and a plurality of pick-up members, the plurality of transfer stations and the plurality of thermal bonding stations are disposed around the rotation mechanism, and the plurality of pick-up members are respectively disposed at a plurality of positions of the rotation mechanism respectively corresponding to the plurality of transfer stations and the plurality of thermal bonding stations to transfer the plurality of target substrates.