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US 2026/0090155 A1Published application
Chip package
AssigneeGuangzhou Luxvisions Innovation Technology Limited
InventorsPyng Yu, Wei-Han Wu
Life of this patent
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Abstract
A chip package includes a substrate, a light-emitting diode chip, and an optical layer. The light-emitting diode chip is disposed on the substrate along a stacking direction. The optical layer is disposed on the light-emitting diode chip along the stacking direction. A refractive index of the optical layer gradually decreases along the stacking direction.
Claims12
A chip package, comprising:
- a substrate;
- a light-emitting diode chip, disposed on the substrate along a stacking direction;
- and
- an optical layer, disposed on the light-emitting diode chip along the stacking direction,
- wherein a refractive index of the optical layer gradually decreases along the stacking direction.
2 more elements
Dependencies are inferred from the claim text.