Light sensor integrated circuit and manufacturing method thereof
AssigneePixart Imaging Inc.
InventorsKheng Chong TEOH, Yoon Seng ONE
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Abstract
There is provided a light sensor integrated circuit including a silicon bond pad, a light source die and a photodiode. The silicon bond pad is formed with conductive epoxy using non-contact dispensing. The conductive epoxy is used to fix the light source die on the silicon bond pad. The light source die is used to emit light toward an encoding medium to generate modulated reflection light propagating to the photodiode.
Claims19
A light sensor integrated circuit (IC), comprising:
- a silicon bond pad, on a surface of the light sensor IC;
- a light source die;
- and
- a conductive epoxy, configured to fix the light source die on the silicon bond pad and electrically connect thereto.
A manufacturing method of a light sensor IC, the light sensor IC comprising a silicon bond pad on a surface thereof, the manufacturing method comprising:
- dispensing a conductive epoxy region on the silicon bond pad using non-contact dispensing;
- attaching a light source die to the conductive epoxy region;
- forming a first bonding wire to connect a first bond pad on the surface of the light sensor IC with the light source die;
- and
- forming a second bonding wire to connect a second bond pad on the surface of the light sensor IC with the silicon bond pad.
A manufacturing method of a light sensor IC, the light sensor IC comprising a silicon bond pad on a surface thereof, the manufacturing method comprising:
- forming a second bonding wire to connect a second bond pad on the surface of the light sensor IC with the silicon bond pad;
- dispensing a conductive epoxy region on the silicon bond pad using non-contact dispensing to cover a bond between the second bonding wire and the silicon bond pad;
- attaching a light source die to the conductive epoxy region;
- and
- forming a first bonding wire to connect a first bond pad on the surface of the light sensor IC with the light source die.
Dependencies are inferred from the claim text.