# US 2026/0089869 A1 · Laptop cooling via low-pressure air mover > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2026/0089869 A1 - Document ID: US20260089869A1 - Status: Published application - Kind: A1 - Application number: 18/897,675 - Filed: 2024-09-26 - Published: 2026-03-26 - Earliest claimed: 2024-09-26 - Assignees: Intel Corporation - Applicants: Intel Corporation - Inventors: Mark MacDonald; Prakash Kurma Raju; Kathiravan D; Doddi Raghavendra; Samarth Alva; Krishnendu Saha - Web page: https://patentgrep.com/patent/US20260089869A1 ## CPC - G06F 1/203: {for portable computers, e.g. for laptops} - H05K 7/20145: {Means for directing air flow, e.g. ducts, deflectors, plenum or guides} - G06F 1/206: {comprising thermal management} - G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract Technical solutions discussed herein include cooling systems for electronic devices, including low-pressure ionic blowers and electromagnetic air movers to improve thermal management in laptops. The cooling system may include multiple blower modules arranged in parallel or series configurations. The thermal solution may be a vapor chamber or a heat pipe, or may include a thin-film air-moving device integrated into an air gap. The cooling system may selectively operate between low pressure blower modules and centrifugal blowers based on cooling demands. The blower module may include an electrode configuration with a single exposed electrode. The cooling system may also incorporate an active noise cancellation system using phase-shifted signals between blower units. ## Claims ### Claim 1 A cooling system for a computing device, comprising: a computing device housing; a heat dissipation structure within the computing device housing, the heat dissipation structure configured to absorb heat from a processing device; an ionic air-moving device configured to generate airflow across the heat dissipation structure to direct heat from the processing device computing out of the computing device housing. ### Claim 2 (depends on 1) The cooling system of claim 1, wherein the ionic air-moving device includes an alternating current (AC) ionic air-moving device, the AC ionic air-moving device including: an exposed electrode in direct contact with air; and an embedded electrode separated from air by a dielectric material. ### Claim 3 (depends on 2) The cooling system of claim 2, wherein the ionic air-moving device is configured to: receive AC current; and generate an electric field to ionize air molecules near the exposed electrode and move ionized air particles toward the embedded electrode. ### Claim 4 (depends on 1) The cooling system of claim 1, wherein the ionic air-moving device is configured to maintain noise levels below a predetermined threshold during operation. ### Claim 5 (depends on 1) The cooling system of claim 1, wherein the ionic air-moving device includes a plurality of low-pressure blowers. ### Claim 6 (depends on 5) The cooling system of claim 5, wherein the plurality of low-pressure blowers are arranged in a modular configuration. ### Claim 7 (depends on 6) The cooling system of claim 6, wherein the modular configuration includes multiple blower modules arranged in a series configuration, a parallel configuration, or a combination of series and parallel configuration. ### Claim 8 (depends on 1) The cooling system of claim 1, further including a thin-film air-moving device. ### Claim 9 (depends on 1) The cooling system of claim 1, further including a centrifugal blower. ### Claim 10 (depends on 9) The cooling system of claim 9, wherein the ionic air-moving device and the centrifugal blower are operated selectively based on cooling demands. ### Claim 11 An apparatus comprising: means for absorbing heat from a processing device at a heat dissipation structure, the processing device and heat dissipation structure disposed within a computing device housing; and means for generating airflow at an ionic air-moving device, the airflow directed through an airflow path and across the heat dissipation structure to direct heat from the processing device computing out of the computing device housing. ### Claim 12 (depends on 11) The apparatus of claim 11, wherein the ionic air-moving device includes an alternating current (AC) ionic air-moving device, the AC ionic air-moving device including an exposed electrode in direct contact with air and an embedded electrode separated from air by a dielectric material. ### Claim 13 (depends on 12) The apparatus of claim 12, wherein the ionic air-moving device is configured to: receive an AC current; and generate an electric field to ionize air molecules near the exposed electrode and move ionized air particles toward the embedded electrode. ### Claim 14 (depends on 11) The apparatus of claim 11, further including means for maintaining noise levels below a predetermined threshold during operation of the ionic air-moving device. ### Claim 15 (depends on 11) The apparatus of claim 11, wherein the ionic air-moving device includes a thin-film ionic air-moving device. ### Claim 16 (depends on 11) The apparatus of claim 11, further including means for selectively activating a centrifugal blower. ### Claim 17 (depends on 16) The apparatus of claim 16, further including means for selectively operating the ionic air-moving device and the centrifugal blower based on cooling demands. ### Claim 18 An air mover for cooling electronic devices, comprising: a computing device housing; a heat dissipation structure within the computing device housing, the heat dissipation structure configured to absorb heat from a processing device; a flexible membrane air-moving device; and an actuator configured to oscillate the flexible membrane air-moving device to generate airflow across the heat dissipation structure to direct heat from the processing device computing out of the computing device housing. ### Claim 19 (depends on 18) The air mover of claim 18, further including an electromagnetic field source generating a field to interact with the actuator. ### Claim 20 (depends on 18) The air mover of claim 18, further including an active noise cancellation system, the active noise cancellation system configured to phase-shift control signals between air mover units.