Bonding head and bonding apparatus including the same

A bonding head comprising:

• a first frame comprising a first top plate extending in a first direction and a second direction intersecting each other;
• a second frame comprising:
• a second top plate facing a lower surface of the first top plate;
• and
• a side plate extending downward from a front end of the second top plate in the first direction and being perpendicular to the first direction;
• a first linear transfer unit coupled to the first top plate and the second top plate and configured to move the second frame relative to the first frame in a third direction intersecting the first direction and the second direction;
• a third frame disposed on an inner surface of the side plate and overlapping the second top plate in the third direction, the third frame comprising:
• a first vertical plate and a second vertical plate which face the side plate and spaced apart from each other in the second direction;
• and
• a first horizontal plate connecting the first vertical plate and the second vertical plate and extending in a direction opposite to the first direction from the first vertical plate;
• a second linear transfer unit disposed on the inner surface of the side plate and configured to move the third frame relative to the second frame in the second direction;
• a head unit disposed below the third frame and coupled to the third frame;
• a cylinder coupled to the third frame and configured to apply downward pressure to the head unit;
• and
• a second linear guide unit configured to guide the third frame for movement in the second direction,
• wherein the second linear guide unit is coupled to the side plate, the first vertical plate, and the second vertical plate, and
• wherein the cylinder is coupled to the first horizontal plate and disposed between the first vertical plate and the second vertical plate in the second direction.

A bonding apparatus comprising:

• a main body frame;
• and
• bonding heads arranged on the main body frame at pitches equal to each other in a first direction, each of the bonding heads comprising:
• a first frame comprising a first top plate extending in the first direction and a second direction intersecting the first direction;
• a second frame comprising:
• a second top plate facing a lower surface of the first top plate and including a front end in the first direction;
• a side plate extending downward from the front end of the second top plate in the first direction and being perpendicular to the first direction;
• a first end which defines the front end in the first direction;
• and
• a second end which defines a rear end in the first direction,
• a first linear transfer unit coupled to the first top plate and the second top plate and configured to move the second frame relative to the first frame in a third direction intersecting the first direction and the second direction;
• a third frame disposed on an inner surface of the side plate and overlapping the second top plate in the third direction;
• a second linear transfer unit disposed on the inner surface of the side plate and configured to move the third frame relative to the second frame in the second direction;
• and
• a head unit disposed below the third frame and coupled to the third frame,
• wherein a third linear transfer unit configured to move each of the bonding heads in the first direction relative to the main body frame,
• wherein a first distance from a first centerline of the first linear transfer unit to the first end of the second frame in the first direction is greater than a second distance from the first centerline of the first linear transfer unit to the second end of the second frame in the first direction.