Semiconductor structure and fabrication method thereof
AssigneeUnited Microelectronics Corp.
InventorsChao-An Su, Weng-Yi Chen, Chang-Sheng Hsu, Shih-Wei Li, Kuo-Hsuan Lo, Chia-Wen Wang, Wen-Hao Cheng
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Abstract
A semiconductor structure includes a substrate having a cavity thereon; a membrane suspended above the cavity and anchored to the substrate, wherein the membrane comprises a central region, a peripheral suspension region, and a coil region between the central region and the peripheral suspension region; and a coil embedded in the coil region of the membrane, wherein the peripheral suspension region has a first concave portion and a first convex portion.
Claims20
A semiconductor structure, comprising:
- a substrate having a cavity thereon;
- a membrane suspended above the cavity and anchored to the substrate, wherein the membrane comprises a central region, a peripheral suspension region, and a coil region between the central region and the peripheral suspension region;
- and
- a coil embedded in the coil region of the membrane, wherein the peripheral suspension region has a first concave portion and a first convex portion.
A method for forming a semiconductor structure, comprising:
- providing a substrate having a cavity thereon;
- forming a membrane on the substrate, wherein the membrane is suspended above the cavity and anchored to the substrate, wherein the membrane comprises a central region, a peripheral suspension region, and a coil region between the central region and the peripheral suspension region;
- and
- forming a coil in the coil region of the membrane, wherein the peripheral suspension region has a first concave portion and a first convex portion.
Dependencies are inferred from the claim text.