# US 2026/0088511 A1 · Dual-band radiating element and modular antenna array

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- Number: US 2026/0088511 A1
- Document ID: US20260088511A1
- Status: Published application
- Kind: A1
- Application number: 19/410,319
- Filed: 2025-12-05
- Published: 2026-03-26
- Earliest claimed: 2020-11-24
- Assignees: MacDonald, Dettwiler and Associates Corporation
- Applicants: MacDonald, Dettwiler and Associates Corporation
- Inventors: Nicholas Boudreau; Aiping Liang; Mathieu Riel
- Web page: https://patentgrep.com/patent/US20260088511A1

## CPC

- H01Q 9/0414: {in a stacked or folded configuration}
- H01Q 1/288: {Satellite antennas}
- H01Q 1/50: Structural association of antennas with earthing switches, lead-in devices or lightning protectors
- H01Q 1/521: {reducing the coupling between adjacent antennas}
- H01Q 1/525: {between emitting and receiving antennas}
- H01Q 3/36: with variable phase-shifters
- H01Q 5/50: Feeding or matching arrangements for broad-band or multi-band operation
- H01Q 9/045: {with particular feeding means (for circular polarisation H01Q9/0428)}
- H01Q 21/0025: {Modular arrays}
- H01Q 21/065: {Patch antenna array}
- H01Q 23/00: Antennas with active circuits or circuit elements integrated within them or attached to them
- H05K 7/20336: {Heat pipes, e.g. wicks or capillary pumps}
- H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72)
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

A dual band radiating element and modular antenna array suitable for application in space communications is provided. The dual band radiating element comprises a stacked patch antenna for transmitting RF signal of a first signal frequency band (e.g. S-Band) and receiving RF signals of a second signal frequency band (e.g. L-Band). The concentric design of the radiating element can achieve savings in material and mass compared to other stacked patch antennas. For effective operation in space applications, a first radiation patch in the radiating element is isolated from a second radiation patch by shielding a feed pin to the first radiation patch as it travels through the dielectric layer separating the patches. Individual radiating elements can be attached to individual filter/amplification units in a modular antenna array allowing for individual components to be easily installed, repaired or replaced with minimal impact to the rest of the antenna array and/or spacecraft.

## Claims

### Claim 1

A dual band radiating array system, comprising:
a dual band radiating array module, comprising:
a combined unit, comprising:
a bottom having at least one attachment point for removably attaching the combined unit to the satellite bus using at least a first mechanical fastener; and
a top having at least one mounting point, a transmit signal interface and a receive signal interface;
a dual band radiating element, comprising:
a first connector and a second connector disposed on a bottom surface of the radiating element; and
at least one aperture for receiving at least a second mechanical fastener for attaching the dual band radiating element to the at least one mounting point,
wherein when attached, the first connector contacts the transmit signal interface and the second connector contacts the receive signal interface.

### Claim 2 (depends on 1)

The dual band radiating array system of claim 1, wherein the combined unit further comprises:
a filter module comprising:
a first band filter connected to the transmit signal interface; and
a second band filter connected to the receive signal interface.

### Claim 3 (depends on 2)

The dual band radiating array system of claim 2, wherein the combined unit further comprises:
a signal amplification module comprising:
a transmit signal amplification unit connected to the first band filter; and
a receive signal amplification unit connected to the second band filter.

### Claim 4 (depends on 3)

The dual band radiating array system of claim 3, wherein the transmit signal amplification unit is a solid-state power amplifier.

### Claim 5 (depends on 3)

The dual band radiating array system of claim 3, wherein the receive signal amplification unit is a low-power amplifier.

### Claim 6 (depends on 3)

The dual band radiating array system of claim 3, further comprising:
an onboard processor, comprising:
a receiving digital beamforming network connected to the receive signal amplification unit; and
a transmitting digital beamforming network connected to the transmit signal amplification unit.

### Claim 7 (depends on 6)

The dual band radiating array system of claim 6, further comprising:
a thermal plate disposed between the signal amplification module and the onboard processor for passively transferring heat away from the signal amplification module and the onboard processor.

### Claim 8 (depends on 7)

The dual band radiating array system of claim 7, wherein the thermal plate comprises:
a panel of thermally conductive material; and
a plurality of oscillating heat pipes embedded in the panel.