Substrate processing apparatus and method
AssigneeManz Taiwan Ltd.
InventorsCheng-Che WU, Hsien-Yi HSIEH, Nan-Hao LIN
Life of this patent
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Abstract
A substrate processing apparatus and method are configured to inspect an initial substrate after a specific process, either when needed or for the first time. After the initial substrate passes the inspecting process, the device and method can perform the specific process on a subsequent substrate with an accumulated processing time corresponding to the time that the initial substrate spent in the inspecting process. The specific process may include a modification process, an etching process, a hole-filling process, or a coating process. By implementing this approach, the substrate processing apparatus and method can reduce manufacturing and inspection times, thereby improving overall manufacturing yield.
Claims20
A substrate processing apparatus, comprising:
- a computing unit, configured to obtain a processing rate and a demand parameter of a specific process, wherein a processing time is computed based on the demand parameter and the processing rate, and an accumulated processing time is initialized;
- a substrate processing device, electrically connected to the computing unit and configured to perform the specific process on a substrate with the processing time;
- and
- an inspecting device, electrically connected to the computing unit and configured to inspect a through via of the substrate after the specific process such that an inspection result data is generated to the computing unit;
- wherein when the computing unit determines that the substrate meets the demand parameter based on the inspection result data, the accumulated processing time is recorded by the computing unit, wherein a subsequent substrate is required to meet the demand parameter subsequently, the substrate processing device is controlled by the computing unit to perform the specific process on the subsequent substrate with the accumulated processing time;
- wherein when the computing unit determines that the substrate does not meet the demand parameter based on the inspection result data and the substrate may have a chance to meet the demand parameter by performing the specific process again, the processing rate is updated by the computing unit based on the inspection result data and the accumulated processing time, and the processing time and the accumulated processing time are updated based on a demand difference and the processing rate after updated, and the specific process is performed on the substrate with the processing time after updated by the substrate processing device.
A substrate processing method performed in a substrate processing apparatus, the substrate processing method comprising:
- obtaining a processing rate and a demand parameter of a specific process;
- computing a processing time based on the demand parameter and the processing rate, wherein an accumulated processing time is initialized;
- performing the specific process on a substrate with the processing time;
- inspecting a through via of the substrate after the specific process to generate an inspection result data to the computing unit;
- performing a subsequent process to the substrate when the inspection result data determines that the substrate meets the demand parameter, wherein the accumulated processing time is recorded, and a subsequent substrate is required to meet the demand parameter subsequently, the substrate processing apparatus is controlled to perform the specific process on the subsequent substrate with the accumulated processing time;
- and
- updating the processing rate based on the inspection result data and the accumulated processing time when the inspection result data determines that the substrate does not meet the demand parameter and the substrate may have a chance to meet the demand parameter by performing the specific process again, wherein the processing time and the accumulated processing time are updated based on a demand difference and the processing rate after updated, and the substrate is performed the specific process with the processing time after updated by the substrate processing apparatus.
Dependencies are inferred from the claim text.