Exposure method and electronic device manufacturing method

An electronic device manufacturing method comprising:

• a first step of
• setting a wavelength of a first pulse laser beam that scans a first scan field of a first semiconductor wafer to a first pattern that changes according to an in-field position along a scanning direction in the first scan field, and
• setting a wavelength of a second pulse laser beam that scans a second scan field of the first semiconductor wafer to a second pattern that changes according to an in-field position along a scanning direction in the second scan field and that is different from the first pattern,
• based on measurement results regarding positional deviation of exposure results by pre-exposure using an exposure apparatus;
• and
• a second step of scanning the first scan field with the first pulse laser beam, and then scanning the second scan field with the second pulse laser beam using the exposure apparatus, to manufacture an electronic device.