Photonic device and method for manufacturing

Abstract

The present invention provides a photonic device, comprising a photonic integrated circuit including a waveguide structure having a core layer and a cladding layer surrounding the core layer, a first cavity formed through a top surface of the photonic integrated circuit and at least partly into the cladding layer, an adhesive layer formed on at least a first surface of the first cavity, and a first photonic element arranged in the first cavity and bonded to the adhesive layer on the first surface of the first cavity, wherein at least a portion of the cladding layer and a portion of the adhesive layer define a first coupling region configured to enable coupling of an optical mode between the core layer and the first photonic element through the coupling region. Further the present invention provides a corresponding method for manufacturing a photonic device as well as.

Dependencies are inferred from the claim text.