Back to results
US 2026/0084352 A1Published application
Injection molding system
AssigneeSeiko Epson Corporation
InventorsMasayuki SAKAI, Kazuya ARAKI
Life of this patent
Estimating the term…
Abstract
An injection molding system includes an injection molding apparatus to which a mold is attached, and an ejection apparatus that ejects a molded product from the mold in a mold open state in which the mold is open, wherein the injection molding apparatus is configured to enable an operator to eject the molded product from the mold at a predetermined work position, and the injection molding apparatus is disposed between the work position and the ejection apparatus.
Claims5
An injection molding system comprising:
- an injection molding apparatus to which a mold is attached;
- and
- an ejection apparatus that ejects a molded product from the mold in a mold open state in which the mold is open, wherein
- the injection molding apparatus is configured to enable an operator to eject the molded product from the mold at a predetermined work position, and
- the injection molding apparatus is disposed between the work position and the ejection apparatus.
2 more elements
Dependencies are inferred from the claim text.